Polarless surface mounting light emitting diode

• US 7,714,334 B2
• Filed: 08/16/2007
• Issued: 05/11/2010
• Est. Priority Date: 08/16/2007
• Status: Active Grant

• Current Assignee: Peter P.W. Lin
• Original Assignee: Peter P.W. Lin
• Inventors: Lin, Peter P. W.
• Primary Examiner(s): Monbleau; Davienne
• Assistant Examiner(s): MULCARE, SHWETA PRASAD
• Application Number:
  US11/839,548
• Publication Number:
  US 20090045428A1
• Time in Patent Office: 999 Days
• Field of Search: 257/81, 257/98, 257/99, 257/100, 257/E33.057, 257/E33.058, 257/E33.059, 257/91, 257/E33.066, 313/231.61, 313/291, 315/224, 362/219, 362/222, 362/236, 362/237, 362/368, 362/800
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A polarless surface mounting light emitting diode comprises a substrate; an upper surface of the substrate being etched with four independent metal thin film blocks; a lower surface of the substrate being formed with two independent metal thin film blocks; two ends of the substrate being formed with electroplated through holes; a plurality of metal thin films adhered upon the upper and lower surfaces of the substrate; two light emitting assemblies, each light emitting assembly being formed by a chip resistor and a chip light emitting diode; and a package layer. The connection of the polarless surface mounting light emitting diode of the present invention is not limited by the polarity. Any end of the polarless surface mounting light emitting diode can be connected to positive electrode or negative electrode.

Claims

1. A polarless surface mounting light emitting diode, comprising:

a substrate having an upper surface and a lower surface;

two ends of the substrate being formed with a left electroplated through hole and a right electroplated through hole, respectively;

a plurality of metal thin films adhered upon the upper and lower surfaces of the substrate;

the metal thin films on the upper surface of the substrate being etched as a left independent metal thin film block, a right independent metal thin film block, an upper independent metal thin film block and a lower independent metal thin film block;

the metal thin films on the lower surface of the substrate being etched as a left metal thin film block and a right metal thin film block;

by the left electroplated through hole and the right electroplated through hole, the left independent metal thin film block and right independent metal thin film block being electrically connected to the left metal thin film block and right metal thin film block, respectively;

two light emitting assemblies, each light emitting assembly being formed by a chip resistor and a chip light emitting diode, the chip resistor and the chip light emitting diode of one of the light emitting assemblies being respectively fixed to the left independent metal thin film block and right independent metal thin film block at the upper surface of the substrate by using conductive glue, and the chip resistor and the chip light emitting diode of the other one of the light emitting assemblies being respectively fixed to the right independent metal thin film block and left independent metal thin film block at the upper surface of the substrate by using conductive glue;

four conductive wires welded respectively to electrically connect the chip resistor and the chip light emitting diode of one of the light emitting assemblies to the upper independent metal thin film block and electrically connect the chip resistor and the chip light emitting diode of the other one of the light emitting assemblies to the lower independent metal thin film block; and

a package layer packaged to the light emitting assemblies of the substrate for protecting the chip resistors and chip light emitting diodes, wherein one of the two chip resistors is serially connected to one of the two chip light emitting diodes as a first circuit set and the other one of the two chip resistors is serially connected to the other one of the two chip light emitting diodes as a second circuit set, the first circuit set is parallel connected to the second circuit set;

at each connection of the two circuit sets, the two circuit sets have opposite polarities so that the polarless surface mounting light emitting diode is not limited by the polarity in connection with other elements.

2. The polarless surface mounting light emitting diode as claimed in claim 1, wherein the light emitting assemblies have the chip resistors so as to be tolerable to high voltage applied thereon and for avoiding the burning of the chip light emitting diodes.

3. The polarless surface mounting light emitting diode as claimed in claim 1, wherein the metal thin films on the lower surface of the substrate are connected to or welded to other circuit elements.