Chip coated light emitting diode package and manufacturing method thereof
First Claim
1. A chip coated Light Emitting Diode (LED) package comprising:
- a light emitting chip including a submount, a chip die attached to the submount and a resin layer covering an outer surface of the chip die;
at least one bump ball provided on the chip die and exposed through an upper surface of the resin layer, the at least one bump ball having an upper surface that is substantially coplanar with the upper surface of the resin layer; and
a package body having an electrode part and the light emitting chip mounted thereon; and
a metal wire connecting the at least one bump ball with the electrode part.
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Accused Products
Abstract
A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
41 Citations
11 Claims
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1. A chip coated Light Emitting Diode (LED) package comprising:
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a light emitting chip including a submount, a chip die attached to the submount and a resin layer covering an outer surface of the chip die; at least one bump ball provided on the chip die and exposed through an upper surface of the resin layer, the at least one bump ball having an upper surface that is substantially coplanar with the upper surface of the resin layer; and a package body having an electrode part and the light emitting chip mounted thereon; and a metal wire connecting the at least one bump ball with the electrode part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification