Interconnect structure and formation for package stacking of molded plastic area array package
First Claim
1. An integrated circuit (IC) package, comprising:
- a substrate having opposing first and second surfaces;
a plurality of contact pads on the first surface of the substrate electrically connected to a plurality of electrically conductive features on the second surface of the substrate;
an integrated circuit (IC) die mounted to the first surface of the substrate;
a plurality of conductive elements formed on the plurality of contact pads on the first surface of the substrate; and
an encapsulating material that encapsulates the IC die and the plurality of conductive elements, wherein a surface of the encapsulating material comprises a first portion and a second portion, wherein the first portion and the second portion are non-planar, wherein the second portion is a depression formed in the surface of the encapsulating material, and wherein the second portion exposes a portion of each conductive element of the plurality of conductive elements.
4 Assignments
0 Petitions
Accused Products
Abstract
Apparatuses, methods, and systems for improved integrated circuit packages are described. An integrated circuit (IC) package includes a substrate having opposing first and second surfaces, an IC die, a plurality of conductive elements, and an encapsulating material. The substrate has a plurality of contact pads on the first surface that are electrically coupled to a plurality of electrically conductive features on the second surface. The plurality of conductive elements is formed on the first surface of the substrate. The IC die is located on the first surface of the substrate. The encapsulating material encapsulates the IC die and a portion of each element of the plurality of conductive elements.
-
Citations
22 Claims
-
1. An integrated circuit (IC) package, comprising:
-
a substrate having opposing first and second surfaces; a plurality of contact pads on the first surface of the substrate electrically connected to a plurality of electrically conductive features on the second surface of the substrate; an integrated circuit (IC) die mounted to the first surface of the substrate; a plurality of conductive elements formed on the plurality of contact pads on the first surface of the substrate; and an encapsulating material that encapsulates the IC die and the plurality of conductive elements, wherein a surface of the encapsulating material comprises a first portion and a second portion, wherein the first portion and the second portion are non-planar, wherein the second portion is a depression formed in the surface of the encapsulating material, and wherein the second portion exposes a portion of each conductive element of the plurality of conductive elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An integrated circuit (IC) package, comprising:
-
a substrate having opposing first and second surfaces; a plurality of contact pads on the first surface of the substrate electrically connected to a plurality of electrically conductive features on the second surface of the substrate; an integrated circuit (IC) die mounted to the first surface of the substrate; a plurality of conductive elements formed on the plurality of contact pads on the first surface of the substrate; an encapsulating material that encapsulates the IC, die and the plurality of conductive elements, wherein a portion of each conductive element of the plurality of conductive elements is exposed at a surface of the encapsulating material; and an electrical component mounted to the surface of the encapsulating material such that a plurality of electrically conductive members of the electrical component is electrically coupled to the plurality of conductive elements, wherein the electrical component is at least one of a resistor, capacitor, or inductor. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
Specification