System and method for mounting an image capture device on a flexible substrate
First Claim
Patent Images
1. A digital camera module comprising:
- a flexible circuit substrate;
an image capture device mounted on said flexible substrate, said image capture device being a bare integrated circuit chip, said integrated circuit chip having a top surface including a sensor array and a bottom surface opposite said top surface, said bottom surface being directly adhered to said flexible circuit substrate; and
a stiffener mounted to an opposite side of said flexible circuit substrate as said integrated circuit chip at a position under said integrated circuit chip, said stiffener including a flat surface that is mounted flush to said opposite side of said flexible circuit substrate.
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Abstract
A digital camera module includes an image capture device mounted on a flexible circuit substrate. In one embodiment of the digital camera module, the image capture device is mounted directly (e.g., by an adhesive) on the flexible circuit substrate. A stiffener (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate to support wire bonding of the image capture device onto the flexible circuit substrate and/or to support the mounting of additional components (e.g., a lens housing).
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Citations
51 Claims
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1. A digital camera module comprising:
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a flexible circuit substrate; an image capture device mounted on said flexible substrate, said image capture device being a bare integrated circuit chip, said integrated circuit chip having a top surface including a sensor array and a bottom surface opposite said top surface, said bottom surface being directly adhered to said flexible circuit substrate; and a stiffener mounted to an opposite side of said flexible circuit substrate as said integrated circuit chip at a position under said integrated circuit chip, said stiffener including a flat surface that is mounted flush to said opposite side of said flexible circuit substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for manufacturing a camera module, comprising:
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providing a flexible circuit substrate; providing an image capture device, said image capture device being a bare integrated circuit chip, said integrated circuit chip including a top surface with light sensors and a bottom surface opposite said top surface; mounting a stiffener to a portion of said flexible circuit substrate; and mounting said image capture device on said flexible circuit substrate by adhering said bottom surface of said integrated circuit chip to said flexible circuit substrate on an opposite side of said flexible circuit substrate as said stiffener; and
whereinmounting said stiffener includes mounting a flat surface of said stiffener flush to said portion of said flexible circuit substrate; and mounting said stiffener includes mounting said stiffener to said flexible circuit substrate before said integrated circuit chip is connected to said flexible circuit substrate. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A camera module comprising:
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a flexible circuit substrate; an image capture device, said image capture device being a bare integrated circuit chip having a top surface and a bottom surface, said top surface including a sensor array, said bottom surface being opposite said top surface; means for directly mounting said bottom surface of said image capture device to a surface of said flexible circuit substrate; and a stiffener positioned under said image capture device on an opposite side of said flexible circuit substrate, said stiffener including a flat surface that is mounted flush to said opposite side of said flexible circuit substrate. - View Dependent Claims (48, 49)
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50. A camera comprising:
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a body; a flexible circuit substrate contained within said body, said flexible circuit substrate having a first surface and a second surface; an image capture device mounted on said flexible circuit substrate, said image capture device being a bare die having a top surface and a bottom surface, said top surface including a sensor array, said bottom surface being opposite said top surface and being directly adhered to said first surface of said flexible circuit substrate; a stiffener positioned under said image capture device on an opposite side of said flexible circuit substrate; and a lens holder mounted on said first surface of said flexible circuit substrate; and
whereinsaid stiffener includes a flat surface that is mounted flush to said opposite side of said flexible circuit substrate. - View Dependent Claims (51)
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Specification