Programmable ROM using two bonded strata
First Claim
1. A programmable read only memory, comprising:
- a first stratum including functional active devices and at least one non-programmed active device;
a second stratum including at least conductive routing to be associated with the at least one non-programmed active device; and
bonded programmable inter-strata connections for coupling the first stratum to the second stratum, the bonded programmable inter-strata connections further comprising bonded micropad connections and including at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for associating the conductive routing with the at least one non-programmed active device.
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Accused Products
Abstract
A read only memory implemented as a 3D integrated device has a first stratum, a second stratum, and bonded inter-strata connections for coupling the first stratum to the second stratum. The physical bonding between the two strata implements the programming of the read only memory. The stratum may be in wafer form or in die form. The first stratum includes functional active devices and at least one non-programmed active device. The second stratum includes at least conductive routing to be associated with the at least one non-programmed active device. The bonded inter-strata connections include at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for providing conductive routing to the programmed active device. The two strata thus form a programmed ROM. Other types of programmable storage devices may be implemented by bonding the two strata.
14 Citations
14 Claims
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1. A programmable read only memory, comprising:
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a first stratum including functional active devices and at least one non-programmed active device; a second stratum including at least conductive routing to be associated with the at least one non-programmed active device; and bonded programmable inter-strata connections for coupling the first stratum to the second stratum, the bonded programmable inter-strata connections further comprising bonded micropad connections and including at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for associating the conductive routing with the at least one non-programmed active device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A programmable read only memory, comprising:
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a first stratum including functional active devices and at least one non-programmed active device; a second stratum including at least conductive routing to be associated with the at least one non-programmed active device; and bonded inter-strata connections for coupling the first stratum to the second stratum, the bonded inter-strata connections including at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for associating the conductive routing with the at least one non-programmed active device, wherein the programming of the at least one bonded programmable inter-strata connection is defined by a mask patterning of micropads on one selected from the group consisting of the first stratum, the second stratum, and a combination of both the first stratum and the second stratum.
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11. A programmable read only memory, comprising:
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a first stratum including functional active devices and at least one non-programmed active device; a second stratum including at least conductive routing to be associated with the at least one non-programmed active device; and bonded inter-strata connections for coupling the first stratum to the second stratum, the bonded inter-strata connections including at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for associating the conductive routing with the at least one non-programmed active device, wherein at least one of the first stratum and the second stratum comprises a substrate having at least one through substrate via, and wherein the at least one bonded programmable inter-strata connection further comprises either (i) a closed programmable inter-strata connection formed by a bonded micropad and through substrate via, or (ii) an open programmable inter-strata connection formed by an absence of a micropad and through substrate via at a bonding interface. - View Dependent Claims (12, 13)
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14. A programmed storage device comprising:
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a first stratum comprising functional active devices and at least one non-programmed active device; a second stratum comprising at least conductive routing to be associated with the at least one non-programmed active device; and bonded inter-strata connections for coupling the first stratum to the second stratum, the bonded inter-strata connections comprising at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for associating the conductive routing with the at least one non-programmed active device, wherein the at least one bonded programmable inter-strata connection comprises one of a closed programmable inter-strata connection and an open programmable inter-strata connection, further wherein the closed programmable inter-strata connection represents a first logic state and the open programmable inter-strata connection represents a second logic state, the second logic state being different from the first logic state, still further wherein the closed programmable inter-strata connection includes a presence of a micropad connection and wherein an open programmable inter-strata connection includes an absence of the micropad connection at a bonding interface, and wherein the first stratum comprises at least one of a semiconductor wafer and a semiconductor die and wherein the second stratum comprises at least one of a semiconductor wafer and a semiconductor die.
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Specification