System package using flexible optical and electrical wiring and signal processing method thereof

• US 7,717,628 B2
• Filed: 01/09/2009
• Issued: 05/18/2010
• Est. Priority Date: 01/14/2008
• Status: Active Grant

• Current Assignee: Korea Photonics Technology Institute
• Original Assignee: Korea Photonics Technology Institute
• Inventors: Lee, Woo Jin, Rho, Byung Sup, Lim, Jung Woon, Hwang, Sung Hwan
• Primary Examiner(s): LEPISTO, RYAN A
• Application Number:
  US12/350,978
• Publication Number:
  US 20090180733A1
• Time in Patent Office: 494 Days
• Field of Search: 385/88, 385/89, 385/92, 385/94
• US Class Current: 385/88
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.

Claims

1. A system package using flexible optical and electrical connections comprising:

at least three rigid substrates having integrated circuit elements mounted thereon, wherein the rigid substrates are arranged substantially parallel and on top of each other;

a plurality of flexible substrates connected to the rigid substrates, wherein the flexible substrates are arranged on alternate sides of the rigid substrates; and

optical and electrical connections that connect the rigid substrates and the flexible substrates to the each other, wherein the optical connections include mirrors mounted on the corresponding rigid substrates and oriented at approximately 45 degrees to reflect light from light emitting elements into the flexible substrates.

2. The system package according to claim 1, wherein the rigid substrates are vertically stacked.

3. The system package according to claim 1, wherein the integrated circuit elements comprises an optical integrated circuit having a light source and a photo detector, a digital integrated circuit, an analog integrated circuit, and a high frequency integrated circuit.

4. The system package according to claim 1, further comprising a heat dissipation device between the rigid substrates.

5. The system package according to claim 4, wherein the heat dissipation device has a planar portion arranged between the rigid substrates and heat dissipation portion offset from the rigid substrates.

6. The system package according to claim 4, wherein the heat dissipation device has a plurality of heat sinks having planar portions arranged between the rigid substrates and having heat dissipating portions offset from the rigid substrates.

7. The system package according to claim 1, further comprising an electromagnetic wave shielding device between the rigid substrates.