Method of forming pores in crystal substrate, and crystal substrate containing pores formed by the same
First Claim
Patent Images
1. A monocrystalline substrate comprising:
- pores formed in a <
100>
direction; and
silver particles existing at a bottom of the pores, the ratio of the pore diameter to the particle diameter being 1 to 2.
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Abstract
A crystalline substrate 1 having straight or spiral deep pores is obtained in cost effective manner. A method for forming pores comprises the steps of preparing the monocrystalline substrate 1 of which (100) surface is processed to be perpendicular to the depth direction of pores to be formed, and an etchant containing 10.0% by weight or less hydrofluoric acid; and chemically etching the substrate surface with metallic particles 2 such as silver, platinum and palladium electroless-plated on it.
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Citations
5 Claims
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1. A monocrystalline substrate comprising:
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pores formed in a <
100>
direction; andsilver particles existing at a bottom of the pores, the ratio of the pore diameter to the particle diameter being 1 to 2. - View Dependent Claims (2, 3)
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4. A mono- or multi-crystalline substrate comprising:
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spiral pores with a pore diameter of 10 to 200 nm and a spiral diameter of 100 to 600 nm; and one or more types of metallic particles selected from silver, platinum and palladium existing at the bottom of pores. - View Dependent Claims (5)
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Specification