Enhanced reliability semiconductor package
First Claim
Patent Images
1. A component package comprising:
- a semiconductor component having a monolithic substrate and a plurality of supports;
a thermally conductive thin film not contacting the plurality of supports and having first and second surfaces, the first surface being cured on the monolithic substrate of the semiconductor component, the second surface being opposite the first surface; and
a printed wiring board having a solder pad thereon, a first surface of the solder pad being adjacent the printed wiring board and a second surface of the solder pad being opposite the first surface of the solder pad, the semiconductor component being mounted on the printed wiring board, and the second surface of the thin film being positioned adjacent the second surface of the solder pad;
wherein a portion of the monolithic substrate facing the printed wiring board is in a direct mechanical bond with the thin film, the second surface of the thin film is in a direct mechanical bond with the second surface of the solder pad, and the solder pad is in a direct mechanical bond with the printed wiring board to provide mechanical bonding and a thermal path between the monolithic substrate and the printed wiring board.
1 Assignment
0 Petitions
Accused Products
Abstract
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
-
Citations
25 Claims
-
1. A component package comprising:
-
a semiconductor component having a monolithic substrate and a plurality of supports; a thermally conductive thin film not contacting the plurality of supports and having first and second surfaces, the first surface being cured on the monolithic substrate of the semiconductor component, the second surface being opposite the first surface; and a printed wiring board having a solder pad thereon, a first surface of the solder pad being adjacent the printed wiring board and a second surface of the solder pad being opposite the first surface of the solder pad, the semiconductor component being mounted on the printed wiring board, and the second surface of the thin film being positioned adjacent the second surface of the solder pad; wherein a portion of the monolithic substrate facing the printed wiring board is in a direct mechanical bond with the thin film, the second surface of the thin film is in a direct mechanical bond with the second surface of the solder pad, and the solder pad is in a direct mechanical bond with the printed wiring board to provide mechanical bonding and a thermal path between the monolithic substrate and the printed wiring board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
-
Specification