Method of operation for SLM-based optical lithography tool

• US 7,719,753 B2
• Filed: 10/24/2007
• Issued: 05/18/2010
• Est. Priority Date: 08/24/2002
• Status: Active Grant

• Current Assignee: Chime Ball Technology Co., Ltd.
• Original Assignee: Maskless Lithography, Inc.
• Inventors: Meisburger, William Daniel
• Primary Examiner(s): Mack; Ricky L
• Assistant Examiner(s): Thomas; Brandi N
• Application Number:
  US11/923,364
• Publication Number:
  US 20090086176A1
• Time in Patent Office: 937 Days
• Field of Search: 359/290, 359/291, 359/292, 359/298, 359/223, 359/224, 355/35, 355/67
• US Class Current: 359/290
• CPC Class Codes: G03F 7/70216 Mask projection systems
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/70466 Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature stitching G03F7/70475
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70558 Dose control, i.e. achievement of a desired dose

Abstract

An optical lithography system comprises a light source, a spatial light modulator, imaging optics and means for continuously moving a photosensitive substrate relative to the spatial light modulator. The spatial light modulator comprises at least one array of individually switchable elements. The spatial light modulator is continuously illuminated and an image of the spatial light modulator is continuously projected on the substrate; consequently, the image is constantly moving across the surface of the substrate. While the image is moving across the surface, elements of the spatial light modulator are switched such that a pixel on the surface of the substrate receives, in serial, doses of energy from multiple elements of the spatial light modulator, thus forming a latent image on the substrate surface. The imaging optics is configured to project a blurred image of the spatial light modulator on the substrate, enabling sub-pixel resolution feature edge placement.

Claims

1. A method of operating a spatial light modulator based optical lithography tool for patterning a substrate, comprising:

defining an area array of pixels on said substrate surface, the size and configuration of said pixels corresponding to the projected spacing and configuration of individually switchable elements in said spatial light modulator;

assigning a dose value to each pixel on said substrate, said dose being computed from a feature pattern in a design data file;

decompressing said dose values for each pixel on said substrate into a sequence of values representing states for each element of said spatial light modulator for each clock cycle, said elements having at least two states, wherein a first state allows light to reach said substrate and a second state stops light from reaching said substrate;

loading said element state values into a spatial light modulator memory;

illuminating said spatial light modulator;

projecting an image of said spatial light modulator on said substrate, said projection being implemented by projection optics situated between said spatial light modulator and said substrate;

once every clock cycle, switching said elements of said spatial light modulator according to said values in said spatial light modulator memory; and

during each clock cycle, displacing said substrate and said projected image relative to each other by a distance equal to said spacing between said pixels;

wherein a pixel on said substrate receives, in serial, doses of energy from multiple elements of said spatial light modulator.

2. A method as in claim 1, wherein said correspondence of said pixels on said substrate to said individually switchable elements in said spatial light modulator is one-to-one.

3. A method as in claim 1, wherein said assigning step includes compensating for distortions and aberrations in said projection optics by adjusting said computed dose values.

4. A method as in claim 1, wherein said assigning step includes compensating for non-uniformities in illumination of said spatial light modulator by adjusting said computed dose values.

5. A method as in claim 1, wherein said decompression step is executed once every clock cycle for a frame of dose data corresponding to the position of said spatial light modulator relative to said substrate, wherein a frame of dose data is the dose data required to define said element state values for all of said elements of said spatial light modulator during one clock cycle.

6. A method as in claim 5, wherein said loading step is executed once every clock cycle.

7. A method as in claim 1, wherein, during exposure of said substrate, said spatial light modulator is illuminated continuously.

8. A method as in claim 7, wherein, during exposure of said substrate, said image of said spatial light modulator is continuously projected on said substrate.

9. A method as in claim 1, wherein said projected image at said substrate surface is blurred.

10. A method as in claim 9, wherein said blurring step is implemented by a diffuser positioned between said spatial light modulator and said photosensitive coating.

11. A method as in claim 1, wherein said spatial light modulator is a digital micro-mirror device and said elements are individually switchable mirrors.

12. A method as in claim 1, further comprising:

measuring the distortion of said substrate; and

modifying said design data file to account for said substrate distortion.

13. A method as in claim 12, wherein switching of said elements of said spatial light modulator is controlled to vary the number of elements of said spatial light modulator that serially contribute to a total dose of energy received by any pixel on said substrate, whereby some pixels on said substrate receive different, non-zero, total doses of energy.

14. A method as in claim 12, wherein said measuring step is implemented by a substrate alignment system.

15. A method as in claim 14, wherein said substrate alignment system comprises a machine vision system.

16. A method as in claim 1, wherein switching of said elements of said spatial light modulator is controlled to vary the number of elements of said spatial light modulator that serially contribute to a total dose of energy received by any pixel on said substrate, whereby some pixels on said substrate receive different, non-zero, total doses of energy.

17. A method as in claim 16, wherein said projected image at said substrate surface is blurred.

18. A method as in claim 17, wherein said switching is controlled to define features in a photosensitive coating on the surface of said substrate and wherein feature edges in said photosensitive coating are shifted by a sub-pixel distance from the pixel edges defined by said area array on said substrate.

19. A method as in claim 16, wherein said elements of said spatial light modulator are arranged in rows and columns on a rectangular grid and wherein the direction of movement of said substrate is parallel to said columns of said elements of said spatial light modulator.

20. A method as in claim 16, wherein said elements of said spatial light modulator are arranged in rows and columns on a rectangular grid and wherein the direction of movement of said substrate is neither parallel nor orthogonal to said columns of said elements of said spatial light modulator.

21. A method as in claim 20, wherein said switching is controlled to define features in a photosensitive coating on the surface of said substrate and wherein feature edges in said photosensitive coating are shifted by a sub-pixel distance from the pixel edges defined by said area array on said substrate.

22. A method as in claim 1, further comprising, before said projecting step, aligning said substrate to said projection optics.

23. A method as in claim 22, wherein said aligning step comprises comparing arbitrary features on said substrate to images previously stored in a memory device.

24. A method as in claim 22, wherein said aligning step comprises comparing arbitrary features on said substrate to idealized images previously stored in a memory device.

25. A method as in claim 24, wherein said idealized images are selected from the group consisting of a cross and a circle.