Semiconductor manufacturing process monitoring

• US 7,720,560 B2
• Filed: 07/26/2007
• Issued: 05/18/2010
• Est. Priority Date: 07/26/2007
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Gilfford, Jeffrey Paul, Menser, Clayton David Jr.
• Primary Examiner(s): Patel; Ramesh B
• Application Number:
  US11/828,730
• Publication Number:
  US 20090030543A1
• Time in Patent Office: 1,027 Days
• Field of Search: 700/80, 700108-110, 700/160, 700/174, 702182-186, 340 343- 344, 340/500, 340/693.12
• US Class Current: 700/121
• CPC Class Codes: G05B 19/4184 characterised by fault tolerance, reliability of production system
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/31355 Fault, if one station defect, stop it, other stations take over
• CPC Class Codes: G05B 2219/31356 Automatic fault detection and isolation
• CPC Class Codes: G05B 2219/31365 Send message to most appropriate operator as function of kind of error
• CPC Class Codes: G05B 2219/32179 Quality control, monitor production tool with multiple sensors
• CPC Class Codes: G05B 2219/32182 If state of tool, product deviates from standard, adjust system, feedback
• CPC Class Codes: G05B 2219/32209 Stop production line
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A system and method for monitoring a semiconductor manufacturing process is disclosed. The system communicates with one or more process tools, and monitors each tool during a predetermined process window time. Errors and warnings are provided to users, allowing corrective action to be taken. Additionally, the system of the present invention can initiate automatic adjustment of the process tools to maintain an efficient manufacturing operation.

Claims

1. A method for monitoring a semiconductor manufacturing process, comprising the steps of:

defining at least one process window time (PWT);

retrieving process data from a process tool;

storing said process data;

analyzing said process data;

generating an action sequence indication based on the outcome of the analyzing step;

accepting at least one process window time from a user;

detecting an initiation event;

initiating a monitoring sequence;

executing an action sequence;

issuing at least one operator alert,

establishing a process window time for a particular process tool;

associating the process window time with a particular job; and

wherein the step of detecting an initiation event comprises the step of detecting the expiry of the process window time.

2. The method of claim 1, wherein the step of detecting an initiation event comprises the step of detecting the arrival of a lot of wafers at the process tool.

3. The method of claim 1, wherein the step of detecting an initiation event comprises the step of detecting a manual initiation from an operator.

4. The method of claim 1, wherein the step of executing an action sequence is selected from the steps of disabling a process, disabling a process tool, and adjusting a process tool.

5. The method of claim 1, wherein the step of issuing at least one operator alert further comprises the step selected from the group of sending an e-mail to a predetermined list of recipients, sending a text message to a predetermined list of recipients, and sending an instant message to a predetermined list of recipients.

6. The method of claim 1, wherein the step of analyzing said process data comprises comparing at least one warning retrieved from a process tool to predetermined warning criteria, and issuing a control action sequence if the retrieved warning matches the predetermined warning criteria.

7. The method of claim 1, wherein the step of adjusting a process tool is selected from the group comprising adjusting the temperature of a tube furnace, and adjusting the slurry flow rate of a chemical mechanical polish tool.

8. The method of claim 1, further comprising:

activating a monitoring system monitoring the semiconductor manufacturing process by starting a timer.

9. The method of claim 8, further comprising:

indicating that the user-specified process window has elapsed when the timer expires.

10. The method of claim 1, further comprising:

examining a status of the process tool when a job starts, and at some predetermined later time, to monitor progress, and identify process problems as early as possible.

11. The method of claim 1, further comprising:

establishing operating parameters for a monitoring system monitoring the semiconductor manufacturing process, wherein said operating parameters are selected from the group consisting of a global PWT, a per process tool default PWT, a job based global PWT, and a job based process tool PWT.

12. The method of claim 1, further comprising:

assigning a seventy level to warnings;

establishing predetermined warning limits;

comparing incoming warnings against the predetermined warning limits;

if the incoming warnings exceed a first threshold, initiating a control action sequence comprising a step selected from the group consisting of adjusting the parameters of the process tool, disabling the process tool, and rerouting wafer carriers to an alternate process tool.

13. The method of claim 12, further comprising:

if the incoming warnings do not exceed the first threshold, and exceed a second threshold lower than the first threshold, notifying the user;

if the incoming warnings do not exceed the first threshold, and exceed a second threshold lower than the first threshold, not notifying the user.