Method of making an electronic device using an electrically conductive polymer, and associated products

• US 7,722,920 B2
• Filed: 05/09/2006
• Issued: 05/25/2010
• Est. Priority Date: 05/13/2005
• Status: Active Grant

• Current Assignee: University of Pittsburgh of The Commonwealth System of Higher Education
• Original Assignee: University of Pittsburgh of The Commonwealth System of Higher Education
• Inventors: Mei, Jungfeng, Lovell, Michael R., Mickle, Marlin H., Cain, James T.
• Primary Examiner(s): Tran; Binh X
• Application Number:
  US11/430,718
• Publication Number:
  US 20060267200A1
• Time in Patent Office: 1,477 Days
• Field of Search: 427/96.1, 427/97.3, 427/97.5, 427/97.6, 427/98.3, 427/99.4
• US Class Current: 427/96.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/25171 Fan-out arrangements
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/82104 using screen printing
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01058 Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01Q 1/2208 : associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H05K 1/095 : for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 2203/1469 : Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 3/12 : using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1216 : by screen printing or stencil printing
• CPC Class Codes: H05K 3/1241 : by ink-jet printing or drawing by dispensing
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Described are methods of making an electronic device, such as an RFID tag, including fabricating an antenna by depositing an electrically conductive polymer onto a substrate. The electrically conductive polymer is electrically connected to an electronic component, such as an IC chip or a diode. The electronic component may be placed on the substrate before or after the electrically conductive polymer is deposited. Once deposited, the electrically conductive polymer is cured. The electrically conductive polymer may be deposited in a number of ways, such using a mask having a desired pattern and applying the electrically conductive polymer to the mask, by screen printing the electrically conductive polymer or by printing the electrically conductive polymer using ink jet printing techniques.

Claims

1. A method of making an electronic device, comprising:

placing an electronic component on a substrate, a first surface of said electronic component contacting a top surface of said substrate, said electronic component having a second surface having one or more electrically conductive contacts, said second surface being opposite said first surface;

depositing an electrically conductive polymer on at least a portion of said second surface and said substrate in a first pattern, said electrically conductive polymer in said first pattern contacting at least one of said one or more electrically conductive contacts;

curing said electrically conductive polymer in said first pattern; and

wherein said electrically conductive polymer in said first pattern forms an antenna.

2. The method according to claim 1, wherein said electronic component is an IC chip.

3. The method according to claim 1, wherein said one or more electrically conductive contacts comprise one or more pads.

4. The method according to claim 1, wherein said depositing step comprises placing a mask over said substrate and said electronic component, said mask having a cut-out portion, said cut-out portion being in substantially the shape of said first pattern, and applying said electrically conductive polymer to said mask to establish said electrically conductive polymer in said first pattern.

5. The method according to claim 1, wherein said depositing step comprises screen printing said electrically conductive polymer in said first pattern.

6. The method according to claim 1, wherein said depositing step comprises printing said electrically conductive polymer in said first pattern using an ink jet print head.

7. The method according to claim 1, wherein said placing step includes affixing said electronic component to said substrate.

8. The method according to claim 1, wherein said electronic device is an RFID tag.

9. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance of about 1.0 ohm/square or less.

10. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance of about 0.5 ohm/square or less.

11. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance in the range of about 1.0 ohm/square to 0.1 ohm/square.

12. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.1 ohm/square to about 0.01 ohm/square.

13. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.01 ohm/square to about 0.001 ohm/square.

14. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.001 ohm/square to about 0.0001 ohm/square.

15. The method according to claim 1, wherein said electrical conductive polymer has a sheet resistance of less than about 0.0001 ohm/square.

16. The method according to claim 1, wherein said electronic component is a non-linear device.

17. The method according to claim 16, wherein said non-linear device is a rectifying diode.

18. A method of making an electronic device, comprising:

placing an electronic component on a substrate, a first surface of said electronic component contacting a top surface of said substrate, said electronic component having a second surface having one or more electrically conductive contacts, said second surface being opposite said first surface;

depositing an electrically conductive polymer on at least a portion of said second surface and said substrate in a first pattern, said electrically conductive polymer in said first pattern contacting at least one of said one or more electrically conductive contacts;

depositing a layer of dielectric material in a second pattern on top of at least a portion of said electrically conductive polymer in said first pattern;

depositing an electrically conductive polymer in a third pattern on top of at least a portion of said layer of dielectric material, said electrically conductive polymer in said third pattern contacting at least one of said one or more electrically conductive contacts; and

curing said electrically conductive polymer in said first pattern and curing said electrically conductive polymer in said third pattern;

wherein said electrically conductive polymer in said first pattern forms an antenna.

19. The method according to claim 18, wherein said second pattern is different from one or both of said first pattern and said third pattern.

20. The method according to claim 18, wherein said first pattern, said second pattern and said third pattern are different from one another.

21. A method of making an electronic device, comprising:

depositing an electrically conductive polymer on at least a portion of a substrate in a first pattern;

placing an electronic component on said substrate, said electronic component having a first surface having one or more electrically conductive contacts, at least one of said one or more electrically conductive contacts contacting a portion of said electrically conductive polymer;

depositing a layer of dielectric material in a second pattern on top of at least a portion of said electrically conductive polymer in said first pattern;

depositing an electrically conductive polymer in a third pattern on top of at least a portion of said layer of dielectric material, at least one of said one or more electrically conductive contacts contacting said electrically conductive polymer in said third pattern; and

curing said electrically conductive polymer in said first pattern and curing said electrically conductive polymer in said third pattern;

wherein said electrically conductive polymer in said first pattern forms an antenna.

22. The method according to claim 21, wherein said electronic component is an IC chip.

23. The method according to claim 21, wherein said one or more electrically conductive contacts comprise one or more pads.

24. The method according to claim 21, wherein said depositing an electrically conductive polymer on at least a portion of a substrate in a first pattern comprises placing a mask over said substrate, said mask having a cut-out portion, said cut-out portion being in said first pattern, and applying said electrically conductive polymer to said mask.

25. The method according to claim 21, wherein said depositing an electrically conductive polymer on at least a portion of a substrate in a first pattern comprises screen printing said electrically conductive polymer in said first pattern.

26. The method according to claim 21, wherein said depositing an electrically conductive polymer on at least a portion of a substrate in a first pattern comprises printing said electrically conductive polymer in said first pattern using an ink jet print head.

27. The method according to claim 21, wherein said second pattern is different than one or both of said first pattern and said third pattern.

28. The method according to claim 21, wherein said first pattern, said second pattern and said third pattern are different than one another.

29. The method according to claim 21, wherein said electronic device is an RFID tag.

30. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance of about 1.0 ohm/square or less.

31. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance of about 0.5 ohm/square or less.

32. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance in the range of about 1.0 ohm/square to 0.1 ohm/square.

33. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.1 ohm/square to about 0.01 ohm/square.

34. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.01 ohm/square to about 0.001 ohm/square.

35. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance in the range of about 0.001 ohm/square to about 0.0001 ohm/square.

36. The method according to claim 21, wherein said electrical conductive polymer has a sheet resistance of less than about 0.0001 ohm/square.

37. The method according to claim 21, wherein said electronic component is a non-linear device.

38. The method according to claim 37, wherein said non-linear device is a rectifying diode.