Method for manufacturing an array of interferometeric modulators

• US 7,723,015 B2
• Filed: 08/01/2007
• Issued: 05/25/2010
• Est. Priority Date: 04/15/2003
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Miles, Mark W.
• Primary Examiner(s): Duda; Kathleen
• Application Number:
  US11/832,471
• Publication Number:
  US 20070269748A1
• Time in Patent Office: 1,028 Days
• Field of Search: 430/311, 430/313, 430/316
• US Class Current: 430/313
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

In one embodiment, the invention provides a method for manufacturing an array of interferometric modulators. Each interferometric modulator comprises first and second optical layers which when the interferometric modulator is in an undriven state are spaced by a gap of one size, and when the interferometric modulator is in a driven state are spaced by a gap of another size, the size of the gap determining an optical response of the interferometric modulator. The method comprises fabricating interferometric modulators of a first type characterized by the size of the gap between its first and second optical layers when in the undriven state; fabricating interferometric modulators of a second type characterized by the size of the gap between its first and second optical layers when in the undriven state; and fabricating modulators of a third type characterized by the size of the gap between its first and second optical layers when in the undriven state, wherein fabricating the interferometric modulators of the first, second, and third types comprises using a sequence of deposition and patterning steps of not more than 9 masking steps to deposit and pattern layers of material on a substrate.

Claims

1. A method for fabricating an interferometric modulator by performing subtractive definition of a multi-height sacrificial layer comprising:

depositing a multilayer sacrificial stack on a substrate for the interferometric modulator, wherein the sacrificial stack comprises a first material and a second material, wherein said first and second materials are etchable by a gas etch, and wherein said first material is etchable by a first solution but not a second solution, and wherein the second material is etchable by the second solution but not the first solution;

removing a portion of a first layer of the sacrificial stack comprising the first material by exposing it to the first solution to leave a remaining portion of the first layer;

removing a portion of a second layer of the sacrificial stack comprising the second material by exposing it to the second solution to leave a remaining portion of the second layer; and

removing the sacrificial stack including the remaining portions of the first layer and the second layer by exposing it to the gas etch.

2. The method of claim 1, wherein the first material comprises silicon.

3. The method of claim 2, wherein the second material comprises molybdenum.

4. The method of claim 1, wherein the gas etch is XeF₂.

5. The method of claim 1, wherein the first solution comprises tetramethylammonium hydroxide.

6. The method of claim 1, wherein the second solution comprises phosphoric acid, acetic acid, or nitric acid.

7. A method for fabricating an interferometric modulator by performing subtractive definition of a multi-height sacrificial layer comprising:

depositing a multilayer sacrificial stack on a substrate for the interferometric modulator, wherein the sacrificial stack comprises;

a first layer comprising a first material, wherein the first material is etchable by a first solution but not a second solution, and

a second layer underlying the first layer, the second layer comprising a second material, wherein the second material is etchable by the second solution but not the first solution;

masking a portion of the first layer and second layer with a resist layer;

etching an unmasked portion of the first layer with the first solution to leave a remaining portion of the first layer, leaving exposed a surface of the second layer not protected by the mask; and

etching an unmasked portion of the second layer with the second solution to leave a remaining portion of the second layer; and

removing the sacrificial stack including the remaining portions of the first layer and the second layer with an etchant.

8. The method of claim 7, wherein the first material comprises silicon.

9. The method of claim 8, wherein the second material comprises molybdenum.

10. The method of claim 7, wherein the etchant is XeF₂.

11. The method of claim 7, wherein the first solution comprises tetramethylammonium hydroxide.

12. The method of claim 7, wherein the second solution comprises phosphoric acid, acetic acid, or nitric acid.

13. A method for manufacturing an array of interferometric modulators defining multiple patterns using a single photolithographic step, the method comprising:

depositing a multi-layer sacrificial stack on a substrate, the sacrificial stack comprising etch material;

applying a photoresist layer over the sacrificial stack, the photoresist layer including a first region and a second region;

positioning a gray-scale mask over the sacrificial stack and the photoresist layer, the gray-scale mask having first and second regions of variable levels of transmission over the first and second regions, respectively, of the photoresist layer;

exposing the photoresist through the gray-scale mask;

developing the first region of the photoresist layer by contacting the stack with a developing solution for an interval of time such that the second region of the photoresist layer does not develop, thereby exposing etch material under the first region of the photoresist layer;

removing the developing solution from the stack and etching the etch material under the first region of the photoresist layer to leave a remaining portion of the etch material; and

removing the multi-layer sacrificial stack including the remaining portion of the etch material.

14. The method of claim 13, further comprising, after removing the developing solution and before removing the multi-layer sacrificial stack:

contacting the stack with the developing solution for an interval of time until the second region of the photoresist layer develops, thereby exposing etch material under the second region of the photoresist layer; and

removing the developing solution from the stack and etching the etch material under the second region of the photoresist layer.

15. The method of claim 14, wherein the multilayer sacrificial stack comprises silicon.

16. The method of claim 15, wherein the multilayer sacrificial stack comprises molybdenum.