Integrated re-combiner for electroosmotic pumps using porous frits

• US 7,723,208 B2
• Filed: 09/24/2003
• Issued: 05/25/2010
• Est. Priority Date: 09/24/2003
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Myers, Alan M., Maveety, James G., Kim, Sarah E., Vu, Quat T., List, R. Scott
• Primary Examiner(s): Garber; Charles D
• Assistant Examiner(s): Isaac; Stanetta D
• Application Number:
  US10/669,205
• Publication Number:
  US 20050074953A1
• Time in Patent Office: 2,435 Days
• Field of Search: 438/26, 438/51, 438/98, 438/100, 438/101, 438/106, 438/107, 438/597, 438/653, 438/669, 438/670, 438685-687, 438/692, 438/422, 438/424, 438/456, 257/E23.098
• US Class Current: 438/456
• CPC Class Codes: F04B 19/006 Micropumps F04B43/043 and F04B43/095 take precedence
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]

Abstract

Trenches may be formed in the upper surfaces of a pair of wafers. Each trench may be coated with a catalyst that is capable of removing oxygen or hydrogen from a fluid used for cooling in a system making use of the electroosmotic effect for pumping. Channels may be formed to communicate fluid to and from the trench coated with the catalyst. The substrates may be combined in face-to-face abutment, for example using copper-to-copper bonding to form a re-combiner.

Claims

1. A method comprising:

forming a trench in an integrated circuit substrate;

lining the trench with a catalyst material to remove gases from a circulating fluid;

forming channels that align with said trench to allow fluid circulation completely across said substrate from one side of said substrate to the other and through said trench; and

protecting said catalyst when forming said channels.

2. The method of claim 1 including depositing platinum as said catalyst in said trench.

3. The method of claim 1 including depositing lead in said trench as said catalyst.