Wired circuit board and production method thereof

• US 7,723,617 B2
• Filed: 08/20/2007
• Issued: 05/25/2010
• Est. Priority Date: 08/30/2006
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Ishii, Jun, Ooyabu, Yasunari
• Primary Examiner(s): Patel; Ishwarbhai B
• Application Number:
  US11/892,052
• Publication Number:
  US 20080053686A1
• Time in Patent Office: 1,009 Days
• Field of Search: 174/254, 360/245.9
• US Class Current: 174/254
• CPC Class Codes: G11B 5/484 Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.

Claims

1. A wired circuit board comprising:

a metal supporting board;

a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μ

m;

a first insulating layer formed on the metal supporting board to cover the metal foil; and

a conductive pattern formed on the first insulating layer, wherein

the first insulating layer is provided so as to cover an upper surface and widthwise side surfaces of the metal foil to form a level difference corresponding to the thickness of the metal foil in the first insulating layer covering a widthwise end portion of the metal foil.

2. The wired circuit board according to claim 1, further comprising:

a first metal thin film formed to be interposed between the metal foil and the metal supporting board.

3. The wired circuit board according to claim 2, further comprising:

a second insulating layer formed to be interposed between the first metal thin film and the metal supporting board.

4. The wired circuit board according to claim 1, further comprising:

a second insulating layer formed to be interposed between the metal foil and the metal supporting board.

5. The wired circuit board according to claim 1, further comprising:

a second metal thin formed to be interposed between the metal foil and the first insulating layer.

6. The wired circuit board according to claim 1, wherein the conductive pattern comprises a plurality of wires arranged in mutually spaced-apart relation and the metal foil comprises a plurality of discrete portions arranged in mutually spaced-apart relation such that at least a portion of the respective discrete portions opposes to the respective wires in a thickness direction.

7. The wired circuit board according to claim 1, wherein the metal foil is formed by sputtering.

8. The wired circuit board according to claim 1, wherein the thickness of the metal foil is in the range of 0.2 to 0.5 μ

m.