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Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

  • US 7,723,730 B2
  • Filed: 11/29/2004
  • Issued: 05/25/2010
  • Est. Priority Date: 11/28/2003
  • Status: Active Grant
First Claim
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1. A semiconductor chip comprising:

  • an epitaxial semiconductor chip region and a chip carrier, the semiconductor chip region being arranged on the chip carrier,wherein the semiconductor chip is free of a growth substrate for the epitaxial semiconductor chip region;

    the chip carrier comprises an electrical insulation layer, andthe electrical insulation layer contains at least one of AlN and a ceramic.

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