Packaged MEMS device assembly

• US 7,723,811 B2
• Filed: 05/03/2006
• Issued: 05/25/2010
• Est. Priority Date: 05/03/2006
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Sterner, John R, Pollard, Jeffrey R, Smith, James Denning, Kang, Henry, Sand, Kirby, Chen, Chien-Hua, Haluzak, Charles C
• Primary Examiner(s): Pham; Long
• Application Number:
  US11/416,709
• Publication Number:
  US 20080272446A1
• Time in Patent Office: 1,483 Days
• Field of Search: 257/415, 257/680, 257/682
• US Class Current: 257/415
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Claims

1. A packaged micro-electromechanical systems (MEMS) device assembly comprising:

a MEMS device;

a substrate within which the MEMS device is disposed;

a lid disposed over the substrate; and

,

one or more of;

one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly;

one or more second cavities within the lid and one or more corresponding overflow areas within the lid, each second cavity containing a material and each corresponding overflow area adapted to catch overflow of the material, where each second cavity is overlapped by a corresponding overflow area having a width greater than a width of the second cavity and a depth shallower than a depth of the second cavity; and

,

one or more third cavities within the lid and one or more channels within at least the substrate to fluidically connect the MEMS device to the third cavities, where the channels are narrower than the third cavities.

2. The packaged MEMS device assembly of claim 1, wherein one or more of the second cavities and the third cavities are a same cavity.

3. The packaged MEMS device assembly of claim 1, wherein a hermetic seal is defined at the interface between the substrate and the lid.

4. The packaged MEMS device assembly of claim 1, comprising at least the first cavities, such that within each of one or more of the first cavities a material is disposed therein, the material comprising one or more of:

a desiccant material, a getter material, and a lubricant.

5. The packaged MEMS device assembly of claim 1, wherein a top of the MEMS device is flush with a top of the substrate within which the MEMS device is disposed.

6. The packaged MEMS device assembly of claim 1, comprising at least the second cavities and the corresponding overflow areas, each second cavity having desiccant disposed therein and a corresponding overflow area adapted to catch overflow of the desiccant.

7. The packaged MEMS device assembly of claim 1, comprising at least the third cavities within the lid and the channels within the substrate.

8. The packaged MEMS device assembly of claim 7, wherein the substrate comprises a first layer and one or more second layers, and the channels each comprise a plurality of holes within the second layers and one or more tubes within the first layer underneath the holes within the second layers.

9. The packaged MEMS device assembly of claim 1, wherein the lid is a glass lid in bonding contact with the substrate.

10. The packaged MEMS device assembly of claim 1, wherein the lid is at least substantially transparent, and the MEMS device comprises a plurality of display elements, such that the packaged MEMS device assembly is part of a display device.

11. The packaged MEMS device assembly of claim 1, wherein the MEMS device is disposed within the substrate such that the substrate comes into direct contact with the MEMS device on a bottom, a left side, and a right side of the MEMS device.