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System and method of a heat transfer system with an evaporator and a condenser

  • US 7,723,845 B2
  • Filed: 10/31/2007
  • Issued: 05/25/2010
  • Est. Priority Date: 09/16/2005
  • Status: Expired due to Fees
First Claim
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1. A system for transferring heat, the heat transfer system comprising:

  • an evaporator comprising a semiconductor layer having porous regions formed at predetermined regions;

    wherein a first surface of the semiconductor layer encapsulated by a cap structure via contacts at a first portion of non-porous regions of the semiconductor layer, a second surface of the semiconductor layer coupled to a chamber formed with a recessed region adjacent to the second surface of the semiconductor layer; and

    wherein the chamber is formed with at least one liquid inlet port and the cap structure is formed with at least one vapor outlet port;

    a condenser having at least one vapor inlet port and at least one liquid outlet port;

    at first set of channels to couple the at least one vapor outlet port of the evaporator with the at least one vapor inlet port of the condenser;

    a second set of channels to couple the at least one liquid outlet port of the condenser with the at least one liquid inlet port of the evaporator; and

    wherein the first and second sets of channels form a substantially hermetically sealed chamber between the evaporator and the condenser.

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