System and method of a heat transfer system with an evaporator and a condenser
First Claim
1. A system for transferring heat, the heat transfer system comprising:
- an evaporator comprising a semiconductor layer having porous regions formed at predetermined regions;
wherein a first surface of the semiconductor layer encapsulated by a cap structure via contacts at a first portion of non-porous regions of the semiconductor layer, a second surface of the semiconductor layer coupled to a chamber formed with a recessed region adjacent to the second surface of the semiconductor layer; and
wherein the chamber is formed with at least one liquid inlet port and the cap structure is formed with at least one vapor outlet port;
a condenser having at least one vapor inlet port and at least one liquid outlet port;
at first set of channels to couple the at least one vapor outlet port of the evaporator with the at least one vapor inlet port of the condenser;
a second set of channels to couple the at least one liquid outlet port of the condenser with the at least one liquid inlet port of the evaporator; and
wherein the first and second sets of channels form a substantially hermetically sealed chamber between the evaporator and the condenser.
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Accused Products
Abstract
The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.
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Citations
13 Claims
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1. A system for transferring heat, the heat transfer system comprising:
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an evaporator comprising a semiconductor layer having porous regions formed at predetermined regions; wherein a first surface of the semiconductor layer encapsulated by a cap structure via contacts at a first portion of non-porous regions of the semiconductor layer, a second surface of the semiconductor layer coupled to a chamber formed with a recessed region adjacent to the second surface of the semiconductor layer; and wherein the chamber is formed with at least one liquid inlet port and the cap structure is formed with at least one vapor outlet port; a condenser having at least one vapor inlet port and at least one liquid outlet port; at first set of channels to couple the at least one vapor outlet port of the evaporator with the at least one vapor inlet port of the condenser; a second set of channels to couple the at least one liquid outlet port of the condenser with the at least one liquid inlet port of the evaporator; and wherein the first and second sets of channels form a substantially hermetically sealed chamber between the evaporator and the condenser. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification