Stacked semiconductor package and method of making same
First Claim
1. A semiconductor package, comprising:
- a substrate having a conductive pattern disposed thereon;
a first semiconductor die electrically connected to the conductive pattern of the substrate;
a high flow layer applied to at least a portion of the first semiconductor die;
a low flow layer applied to at least a portion of the high flow layer;
a second semiconductor die attached to the low flow layer and electrically connected to the conductive pattern of the substrate; and
a package body at least partially encapsulating the first semiconductor die, the second semiconductor die, the high and low flow layers, and the substrate.
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Accused Products
Abstract
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including two or more semiconductor dies which are electrically connected to an underlying substrate through the use of conductive wires, some of which may be fully or partially encapsulated by an adhesive or insulating layer of the package. In a basic embodiment of the present invention, the semiconductor package comprises a substrate having a conductive pattern disposed thereon. Electrically connected to the conductive pattern of the substrate are first and second semiconductor dies. The first semiconductor die and a portion of the substrate are covered by an adhesive layer. The second semiconductor die, the adhesive layer and a portion of the substrate are in turn covered by a package body of the semiconductor package.
356 Citations
18 Claims
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1. A semiconductor package, comprising:
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a substrate having a conductive pattern disposed thereon; a first semiconductor die electrically connected to the conductive pattern of the substrate; a high flow layer applied to at least a portion of the first semiconductor die; a low flow layer applied to at least a portion of the high flow layer; a second semiconductor die attached to the low flow layer and electrically connected to the conductive pattern of the substrate; and a package body at least partially encapsulating the first semiconductor die, the second semiconductor die, the high and low flow layers, and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of fabricating a semiconductor package, comprising the steps of:
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a) providing a substrate having a conductive pattern disposed thereon; b) attaching a first semiconductor die to the substrate; c) electrically connecting the first semiconductor die to the conductive pattern of the substrate; d) encapsulating the first semiconductor die and covering at least a portion of the substrate with an adhesive layer which is attached to a second semiconductor die; e) electrically connecting the second semiconductor die to the conductive pattern of the substrate; and f) forming a package body to at least partially encapsulate the second semiconductor die, the adhesive layer and the substrate.
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15. A semiconductor package, comprising:
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a substrate comprising an insulative layer defining opposed first and second surfaces, a plurality of lands disposed on the first surface, and a conductive pattern disposed on the second surface and electrically connected to the lands in a prescribed manner; a first semiconductor die electrically connected to the conductive pattern of the substrate; a flow layer applied to a least a portion of the first semiconductor die; a second semiconductor die attached to the flow layer and electrically connected to the conductive pattern of the substrate; and a package body at least partially encapsulating the first semiconductor die, the second semiconductor die, the flow layer, and the substrate; the flow layer including at least first and second portions which are of differing viscosities.
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16. A semiconductor package, comprising:
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a substrate having a conductive pattern disposed thereon; a first semiconductor die electrically connected to the conductive pattern of the substrate through the use of first conductive wires; a flow layer applied to a least a portion of the first semiconductor die; a second semiconductor die attached to the flow layer and electrically connected to the conductive pattern of the substrate; and a package body at least partially encapsulating the first semiconductor die, the second semiconductor die, the flow layer, and the substrate; the flow layer including at least first and second portions, the first portion of the flow layer being of a first viscosity and the second portion of the flow layer being of a second viscosity which exceeds the first viscosity, the first conductive wires each being partially encapsulated by the first portion of the flow layer and partially encapsulated by the package body. - View Dependent Claims (17, 18)
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Specification