Package for an implantable device

• US 7,725,191 B2
• Filed: 10/28/2007
• Issued: 05/25/2010
• Est. Priority Date: 03/24/1999
• Status: Expired due to Term

• Current Assignee: Second Sight Medical Products, Inc.
• Original Assignee: Second Sight Medical Products, Inc.
• Inventors: Greenberg, Robert J., Schulman, Joseph H.
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): Gedeon; Brian T
• Application Number:
  US11/926,030
• Publication Number:
  US 20080077195A1
• Time in Patent Office: 940 Days
• Field of Search: 607/2, 607/36, 607/115
• US Class Current: 607/36
• CPC Class Codes: A61N 1/0543 Retinal electrodes
• CPC Class Codes: A61N 1/36046 of the eye
• CPC Class Codes: A61N 1/37247 User interfaces, e.g. input or presentation means
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package may include a hard hermetic box, a thin film hermetic coating, or both.

Claims

1. An implantable device, comprising:

an electrically non-conductive substrate;

a plurality of electrically conductive straight feedthroughs through said electrically non-conductive substrate;

a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a said plurality of electrically conductive straight feedthroughs; and

a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive straight feedthroughs forming a hermetic package.

2. The implantable device according to claim 1, wherein said electrically non-conductive substrate contains ceramic.

3. The implantable device according to claim 2, wherein said cover contains metal.

4. The implantable device according to claim 3, wherein said cover is brazed to said electrically non-conductive substrate.

5. The implantable device according to claim 1, further comprising a plurality of electrodes electrically coupled to said plurality of electrically conductive straight feedthroughs.

6. The implantable device according to claim 5, wherein said plurality of electrodes are bonded to said plurality of electrically conductive straight feedthroughs by insulated wires.

7. The implantable device according to claim 6, wherein said plurality of electrodes are suitable for stimulating tissue.

8. A method of making an implantable device, comprising:

providing a ceramic containing non-conductive substrate defining a plurality of electrically conductive straight feedthroughs;

brazing a metallic ring to said ceramic containing non-conductive substrate;

electrically connecting a circuit to said electrically conductive straight feedthroughs by flip-chip attach; and

welding a metallic top to said metallic ring.

9. The method according to claim 8, wherein said step of welding is laser welding.

10. An implantable device, comprising:

an substantially planar electrically non-conductive substrate;

a plurality of electrically conductive straight feedthroughs through said electrically non-conductive substrate forming electrodes;

a circuit attached to said electrically non-conductive substrate and electrically connected to said plurality of electrically conductive straight feedthroughs; and

a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive straight feedthroughs forming a hermetic package.

11. The implantable device according to claim 10, wherein an electrode is bonded to said electrically conductive straight feedthroughs.

12. The implantable device according to claim 10, wherein an electrode is electroplated to said electrically conductive straight feedthroughs.

13. The implantable device according to claim 10, wherein said circuit is a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to said plurality of electrically conductive straight feedthroughs.

14. The implantable device according to claim 10, wherein said electrically non-conductive substrate contains ceramic.

15. The implantable device according to claim 14, wherein said ceramic comprises aluminum oxide.

16. The implantable device according to claim 14, wherein said ceramic comprises zirconium oxide.

17. The implantable device according to claim 10, wherein said cover contains metal.

18. The implantable device according to claim 10, wherein said cover is brazed to said electrically non-conductive substrate.

19. The implantable device according to claim 18, wherein said cover is brazed with a braze comprising Titanium.

20. The implantable device according to claim 18, wherein said cover is brazed with a braze comprising Nickel.

21. The implantable device according to claim 18, wherein said cover is brazed with a braze comprising gold.