Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing

• US 7,725,208 B2
• Filed: 12/31/2007
• Issued: 05/25/2010
• Est. Priority Date: 06/19/2001
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Schwarm, Alexander T., Shanmugasundram, Arulkumar P.
• Primary Examiner(s): Jarrett; Ryan A
• Application Number:
  US12/006,328
• Publication Number:
  US 20080133163A1
• Time in Patent Office: 876 Days
• Field of Search: 702/83, 700/108, 700/121, 700/110
• US Class Current: 700/110
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 49/03 according to the final size of the previously ground workpiece
• CPC Class Codes: B24B 49/18 taking regard of the presence of dressing tools
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: G05B 19/00 Programme-control systems
• CPC Class Codes: G05B 19/19 characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/32053 Adjust work parameter as function of other cell
• CPC Class Codes: G05B 2219/32065 Synchronise set points of processes
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/80 Management or planning

Abstract

Systems, methods and mediums are provided for dynamic adjustment of sampling plans in connection with a wafer (or other device) to be measured. The invention adjusts the frequency and/or spatial resolution of measurements on an as-needed basis when one or more events occur that are likely to indicate an internal or external change affecting the manufacturing process or results. The dynamic metrology plan adjusts the spatial resolution of sampling within-wafer by adding, subtracting or replacing candidate points from the sampling plan, in response to certain events which suggest that additional or different measurements of the wafer may be desirable. Further, the invention may be used in connection with adjusting the frequency of wafer-to-wafer measurements.

Claims

1. A computer-implemented method of measuring at least one manufacturing characteristic for at least one wafer from a lot of wafers manufactured by a manufacturing process, comprising:

providing information representative of a set of candidate points to be measured by the manufacturing process on the at least one wafer from the lot of wafers;

executing, by a computer system, a plan for performing measurements on the at least one wafer from the lot of wafers to measure the at least one manufacturing characteristic, the plan defining at least one of;

which of the wafers in the lot of wafers are to be measured and which candidate points on the wafers to be measured to make measurements on;

detecting one of a plurality of events or a lack of one of the plurality of events indicating a change in the manufacturing process, the change pertaining to at least one of;

detecting a fault in the manufacturing process, and detecting a variation in a measurement of the at least one wafer;

determining whether to take more or fewer measurements on at least one subsequent wafer in the lot of wafers to be measured based on the detected event or lack of the event; and

adjusting the plan, in real time, to increase a spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take more measurements, and to decrease the spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take fewer measurements.

2. The method of claim 1, wherein the plan further comprises information representative of a metrology recipe.

3. The method of claim 1, wherein the plan defines at least one region on the wafer, each of the candidate points corresponding to the at least one region.

4. The method of claim 1, wherein the adjusting the plan comprises:

determining at least one region corresponding to the detected change;

selecting at least one measurement responsive to candidate points corresponding to the determined region;

assigning the selected at least one measurement as an additional measurement to be performed or as a measurement to be removed under the plan; and

revising at least one of the measurements, the selected measurement, and the plan.

5. The method of claim 1, wherein adjusting the plan comprises:

determining whether the detected change is of a type that affects a series of wafers; and

determining whether to measure at least one of the wafers in the series of wafers based on the determination of whether the detected change is of a type that affects a series of wafers.

6. The method of claim 5, wherein there is provided a plurality of wafers in the lot of wafers, including the at least one wafer, and wherein the plan further comprises:

first information representative of the wafers in the lot of wafers that are available to be measured; and

second information representative of the wafers in the lot of wafers that are to be measured under the plan.

7. The method of claim 1, further comprising discarding information representative of measurement results on the at least one wafer when at least one of:

the measurement results indicate a variation in measurement of the at least one wafer, and a fault is detected in the manufacturing process.

8. The method of claim 1, wherein the plan comprises:

a plurality of splines radiating from a center of the at least one wafer, the candidate points being distributed along the splines; and

a distribution of the candidate points along the splines weighted according to a surface area of the at least one wafer.

9. A computer-implemented system of measuring at least one manufacturing characteristic for at least one wafer from a lot of wafers manufactured by a manufacturing process, comprising:

a memory to store information representative of a set of candidate points to be measured by the manufacturing process on the at least one wafer, and information representative of a plan for performing measurements on the at least one wafer to measure the at least one manufacturing characteristic, the plan defining at least one of;

which of the wafers in the lot of wafers are to be measured and which candidate points on the wafers to be measured to make measurements on; and

a processor, coupled to the memory, programmed to

detect one of a plurality of events or a lack of one of the plurality of events indicating a change in the manufacturing process, the change pertaining to at least one of;

detecting a fault in the manufacturing process, and detecting a variation in a measurement of the at least one wafer;

determine whether to take more or fewer measurements on at least one subsequent wafer in the lot of wafers to be measured based on the detected event or lack of the event; and

adjust the plan, in real time, to increase a spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take more measurements, and to decrease the spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take fewer measurements.

10. The system of claim 9, wherein the manufacturing process is an automated semi-conductor manufacturing process, further comprising at least one metrology tool for performing measurements on the semi-conductor wafer, operatively connected to the processor.

11. The system of claim 9, wherein the plan further comprises information representative of a metrology recipe.

12. The system of claim 9, wherein to adjust the plan comprises:

determining at least one region corresponding to the detected change;

selecting at least one measurement responsive to candidate points corresponding to the determined region;

assigning the selected at least one measurement as an additional measurement to be performed or as a measurement to be removed under the plan; and

revising at least one of the measurements, the selected measurement and the plan.

13. The system of claim 9, wherein to adjust the plan comprises:

determining whether the detected change is of a type that affects a series of wafers;

determining whether to measure at least one of the wafers in the series of wafers based on the determination of whether the detected change is of a type that affects a series of wafers.

14. The system of claim 13, wherein there is provided a plurality of wafers in the lot of wafers, including the at least one wafer, and wherein the plan further comprises:

first information representative of the wafers in the lot of wafers that are available to be measured; and

second information representative of the wafers in the lot of wafers that are to be measured under the plan.

15. The system of claim 9, wherein the memory is further to store information representative of measurement results on the at least one wafer, except when at least one of:

the measurement results indicate a variation in measurement of the at least one wafer, and when a fault is detected in the manufacturing process.

16. The system of claim 9, wherein the plan comprises:

a plurality of splines radiating from a center of the at least one wafer, the candidate points being distributed along the splines; and

a distribution of the candidate points along the splines is weighted according to a surface area of the at least one wafer.

17. A tangible computer readable medium for measuring at least one manufacturing characteristic for at least one wafer from a lot of wafers manufactured by a manufacturing process, storing executable instructions which when executed on a processing system cause the processing system to perform a method comprising:

providing information representative of a set of candidate points to be measured by the manufacturing process on the at least one wafer from the lot of wafers;

executing, by the manufacturing process, a plan for performing measurements on the at least one wafer from the lot of wafers to measure the at least one manufacturing characteristic, the plan defining at least one of;

which of the wafers in the lot of wafers are to be measured and which candidate points on the wafers to be measured to make measurements on;

detecting one of a plurality of events or a lack of one of the plurality of events indicating a change in the manufacturing process, the change pertaining to at least one of;

detecting a fault in the manufacturing process, and detecting a variation in a measurement of the at least one wafer;

determining whether to take more or fewer measurements on at least one subsequent wafer in the lot of wafers to be measured due to the detected event or lack of the event; and

adjusting the plan, in real time, to increase a spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take more measurements, and to decrease the spatial density of measurements on at least one subsequent wafer in the lot of wafers to be measured upon determining to take fewer measurements.

18. The tangible computer readable medium of claim 17, wherein adjusting the plan comprises:

determining at least one region corresponding to the detected change;

selecting at least one measurement responsive to candidate points corresponding to the determined region;

assigning the selected at least one measurement as an additional measurement to be performed or as a measurement to be removed under the plan; and

revising at least one of the measurements, the selected measurement, and the plan.

19. The tangible computer readable medium of claim 17, wherein adjusting the plan comprises:

determining whether the detected change may is of a type that affects a series of wafers; and

determining whether to measure at least one of the wafers in the series of wafers based on the determination of whether the detected change is of a type that affects a series of wafers.

20. The tangible computer readable medium of claim 17, further comprising instructions for discarding information representative of measurement results on the at least one wafer when at least one of:

the measurement results indicate a variation in measurement of the at least one wafer, and a fault is detected in the manufacturing process.

21. The tangible computer readable medium of claim 17, wherein the plan defines at least one region on the wafer, each of the candidate points corresponding to the at least one region.