Low cost vehicle electrical and electronic components and systems manufactured from conductive loaded resin-based materials

• US 7,726,440 B2
• Filed: 06/08/2005
• Issued: 06/01/2010
• Est. Priority Date: 02/15/2001
• Status: Expired due to Fees

• Current Assignee: Integral Technologies, Inc.
• Original Assignee: Integral Technologies, Inc.
• Inventors: Aisenbrey, Thomas
• Primary Examiner(s): Donels; Jeffrey
• Assistant Examiner(s): Phillips; Forrest M
• Application Number:
  US11/148,044
• Publication Number:
  US 20050224280A1
• Time in Patent Office: 1,819 Days
• Field of Search: 181/148, 181/199, 252/512, 174/35, 174/388
• US Class Current: 181/148
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/0013 using fillers dispersed in the moulding material, e.g. metal particles
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01Q 1/3291 mounted in or on other locations inside the vehicle or vehicle body
• CPC Class Codes: H01R 4/58 characterised by the form or material of the contacting members H01R4/01 takes precedence

Abstract

Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Claims

1. A vehicle electrical component device comprising:

a bottom plate; and

four sides joining to said bottom plate wherein said bottom plate and four sides comprise a conductive loaded, resin-based material consisting essentially of micron conductive fiber in a base resin host wherein the percent by weight of said conductive materials is between 20% and 40% of the total weight of said conductive loaded resin-based material wherein said micron conductive fiber has a diameter of between 3 μ

m and 11 μ

m and a length of between 5 mm and 10 mm.

2. The device according to claim 1 wherein said micron conductive fiber is nickel plated carbon micron fiber, stainless steel micron fiber, copper micron fiber, silver micron fiber or combinations thereof.

3. A vehicle electrical component device comprising:

a bottom plate; and

four sides joining to said bottom plate wherein said bottom plate and four sides comprise a conductive loaded, resin-based material consisting essentially of micron conductive fiber and conductive powder in a base resin host wherein the percent by weight of said conductive materials is between 20% and 40% of the total weight of said conductive loaded resin-based material wherein said micron conductive fiber has a diameter of between 3 μ

m and 11 μ

m and a length of between 5 mm and 10 mm.

4. The device according to claim 3 wherein said conductive powder is nickel, copper, or silver.

5. The device according to claim 3 wherein said conductive powder is a non-metallic material with a metal plating.

6. A vehicle electrical component device comprising:

a bottom plate; and

four sides joining to said bottom plate wherein said bottom plate and four sides comprise a conductive loaded, resin-based material consisting essential of micron conductive fiber in a base resin host wherein the percent by weight of said micron conductive fiber is between 20% and 40% of the total weight of said conductive loaded resin-based material and wherein said micron conductive fiber has a diameter of between 3 μ

m and 11 μ

m and a length of between 5 mm and 10 mm and wherein said micron conductive fiber is stainless steel.