Extensible robust modular electronic device without direct electrical connections for inter-module communication or control
First Claim
1. A modular electronic device comprising:
- a first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals;
a second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals;
a third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals;
an alignment attachment mechanism constructed to align and retain the modules relative together to one another;
wherein the alignment attachment mechanism comprising one first protrusion and a corresponding recession one each of the first, second and third electronic modules;
wherein the protrusions physically engaging the recessions; and
wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals.
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Accused Products
Abstract
A modular electronic device where (predominantly) sealed modules are aligned and attached/connected in pre-determined sequences, forming a robust block-like structure with extendable function: Control and/or inter-module communication are implemented without direct electrical interconnect, by non-contact means such as (magnetic, inductive, light, infrared, radio frequency, sound, ultrasound, or other non-contact means). This device'"'"'s inter-module power transfer may be with or without direct electrical contact, or devices may be internally powered. Power transfer through inductive/transformer action where one or more alignment pins are used as transformer core is one potential implementation. Modules may be liquid filled to facilitate cooling and/or crush resistance to high-pressure environments.
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Citations
20 Claims
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1. A modular electronic device comprising:
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a first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals; a second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals; a third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals; an alignment attachment mechanism constructed to align and retain the modules relative together to one another; wherein the alignment attachment mechanism comprising one first protrusion and a corresponding recession one each of the first, second and third electronic modules; wherein the protrusions physically engaging the recessions; and wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A modular electronic device comprising:
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a first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals; a second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals; a third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals; an alignment attachment mechanism constructed to align and retain the modules relative together to one another; wherein the alignment attachment mechanism comprising a plurality of first protrusions and corresponding recessions one each of the first, second and third electronic modules; and wherein the protrusions physically engaging the recessions; and wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals, without transmitting or receiving the data communication signals through an alignment mechanism. - View Dependent Claims (10, 11, 12, 13, 19)
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14. A modular electronic device comprising:
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a first electronic module including a first communication mechanism configured to facilitate transmission and reception of data communication input/output signals; a second electronic module including a second communication mechanism configured to facilitate transmission and reception of data communication input/output signals with the first electronic module without direct electrical contact of data communication signals; a third electronic module including a third communication mechanism configured to facilitate transmission and reception of data communication input/output signals between the modules without direct electrical contact of data communication signals; wherein the modules are aligned; wherein the modules are physically connected; and wherein the data communication input/output signals transmit and receive data communication signals between modules without electrical contact of data communication signals. - View Dependent Claims (15, 16, 17, 18, 20)
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Specification