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Controlled composition using plasma-enhanced atomic layer deposition

  • US 7,727,864 B2
  • Filed: 11/01/2006
  • Issued: 06/01/2010
  • Est. Priority Date: 11/01/2006
  • Status: Active Grant
First Claim
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1. A method of depositing a metallic-compound film in a plasma-enhanced atomic layer deposition (PEALD) process, comprising:

  • alternately and sequentially contacting a substrate in a reaction space with spatially and temporally separated vapor phase pulses of at least three different reactants, the at least three different reactants comprising;

    a metal source chemical;

    a plasma-excited species; and

    a source chemical of a non-metal species desired in the metallic-compound film,wherein plasma parameters for generating the plasma-excited species are selected to reduce the oxidation state of the metal in the metallic-compound film relative to its oxidation state in the metal source chemical and achieve the metallic-compound film with a predetermined composition.

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