Plasma processing apparatus with dielectric plates and fixing member wavelength dependent spacing

• US 7,728,251 B2
• Filed: 10/27/2005
• Issued: 06/01/2010
• Est. Priority Date: 10/29/2004
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Sasaki, Atsushi, Nakata, Yukihiko, Azuma, Kazufumi, Ide, Tetsuya
• Primary Examiner(s): Ralis; Stephen J
• Application Number:
  US11/259,190
• Publication Number:
  US 20060090704A1
• Time in Patent Office: 1,678 Days
• Field of Search: 219/121.43, 219/121.4, 219/121.41, 219/746, 219/748, 118/723.MW, 118/723.MA, 118/723.ME, 118/723.AN, 204/298.19, 204/298.38, 204/192.12, 156/345.36, 156/345.41, 315/111.21, 315/111.41
• US Class Current: 219/121.43
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32238 Windows

Abstract

In a plasma processing apparatus, electromagnetic waves are radiated from slots of waveguides into a processing chamber via dielectric windows that are supported on beams, thereby generating a plasma. A substrate, which is an object of processing, is processed by the generated plasma. Dielectric plates are attached to those surfaces of the beams, which are opposed to the processing chamber. The thickness of each dielectric plate is set at ½ or more of the intra-dielectric wavelength of the electromagnetic waves. Using the plasma processing apparatus, a large-area processing can uniformly be performed.

Claims

1. A plasma processing apparatus comprising:

a processing chamber configured to enclose and process a substrate;

an electromagnetic source configured to output electromagnetic waves;

a plurality of waveguides configured to propagate the electromagnetic waves;

a waveguide antenna including a plurality of slots formed in each of the plurality of waveguides and configured to radiate the electromagnetic waves;

a plurality of dielectric windows formed of a dielectric material to transmit the electromagnetic waves, associated with the plurality of slots, and form a surface that is oriented towards an inner space of the processing chamber and are supported air tightly by metallic beams; and

a plurality of dielectric plates arranged between the plurality of dielectric windows and the processing chamber, sidewalls of adjacent dielectric plates of the plurality of dielectric plates being in direct contact with each other, the plurality of dielectric plates provided on inner surfaces of the plurality of dielectric windows and metallic beams, which support the plurality of dielectric windows in the processing chamber, such that plasma is continuously and uniformly produced in the processing chamber, and a thickness of each of the dielectric plates in direction of propagation of the electromagnetic waves is set substantially at a half a wavelength or more of the electromagnetic waves inside the dielectric plates,

wherein the plasma processing apparatus is configured to generate plasma by the electromagnetic waves that are radiated from the slots into the processing chamber via the plurality of dielectric windows, and the generated plasma is configured to process the substrate inside the processing chamber, and

wherein the plurality of dielectric plates are arranged such that a location where the plates are laterally in contact with each other is located under the plurality of dielectric windows, and is centered between the side edges of the plurality of dielectric windows so as not to be under a seam of adjacent dielectric windows, and the plurality of dielectric plates are attached to a lower surface of the metallic beams by fixing members.

2. The plasma processing apparatus according to claim 1, wherein the thickness of the dielectric plates in the direction in which the electromagnetic waves propagate is set at a value that satisfies a following equation:

h=(m·

π

·

λ

)/(2π

·

(∈

_d)^0.5·

cos β

)

where h;

the thickness of the dielectric plate, m;

an integer of 1 or more, λ

;

a wavelength of the electromagnetic waves in a vacuum, ∈

_d;

a specific dielectric constant of the dielectric plate, and β

;

a refraction angle at which the electromagnetic waves are incident on the dielectric plate.

3. The plasma processing apparatus according to claim 1, wherein the fixing members are spaced apart with a pitch of a half a wave length or more of the electromagnetic waves inside the dielectric plates, and are at least partly formed of a conductive material.

4. The plasma processing apparatus according to claim 3, wherein the fixing members are arranged such that the fixing members are spaced apart with a pitch of an n-number (n=an integer of 1 or more) of times of a half a wave length or more of the electromagnetic waves inside the dielectric plates.

5. The plasma processing apparatus according to claim 1, wherein the

fixing members are arranged to penetrate the dielectric plates so as not to obstruct a surface of the plurality of dielectric plates that faces the processing chamber.

6. The plasma processing apparatus according to claim 1, wherein a center portion of an upper surface of the plurality of dielectric plates is in contact with the lower surface of the metallic beams, and the fixing members are arranged at a center of the plurality of dielectric plates and the metallic beams.

7. A plasma processing apparatus including a plurality of waveguides that are configured to distribute electromagnetic waves from an electromagnetic wave source, the apparatus comprising:

a plurality of dielectric windows formed of a dielectric material, to transmit the electromagnetic waves, associated with a plurality of slot antennas, and forming a surface that is oriented towards an inner space of the processing chamber and are supported air tightly by metallic beams to form a sealed surface of the processing chamber; and

a plurality of dielectric plates arranged between the plurality of dielectric windows and the processing chamber, sidewalls of adjacent dielectric plates of the plurality of dielectric plates being in direct contact with each other, the plurality of dielectric plates provided on inner surfaces of the plurality of dielectric windows and metallic beams, which support the plurality of dielectric windows in the processing chamber, such that plasma is continuously and uniformly produced in the processing chamber, and a thickness of each of the dielectric plates in a direction of propagation of the electromagnetic waves is set substantially at a half wavelength or more of the electromagnetic waves inside the dielectric plate,

wherein the plasma processing apparatus is configured to generate a surface-wave plasma on inner wall surfaces of the dielectric plates by the electromagnetic waves that are radiated from the slots into the processing chamber via the plurality of dielectric windows, and the generated plasma is configured to process the substrate inside the processing chamber, and

wherein the plurality of dielectric plates are arranged such that a location where the plates are laterally in contact with each other is located and under the plurality of dielectric windows, and is centered between side edges of the plurality of dielectric windows so as not to be under a seam of adjacent dielectric windows, and the plurality of dielectric plates are attached to a lower surface of the metallic beams by fixing members.

8. The plasma processing apparatus according to claim 7, wherein the

fixing members are arranged to penetrate the dielectric plates so as not to obstruct a surface of the plurality of dielectric plates that faces the processing chamber.

9. The plasma processing apparatus according to claim 7, wherein a center portion of an upper surface of the plurality of dielectric plates is in contact with the lower surface of the metallic beams, and the fixing members are arranged at a center of the plurality of dielectric plates and the metallic beams.