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Image sensor and method for manufacturing the same

  • US 7,728,351 B2
  • Filed: 12/31/2007
  • Issued: 06/01/2010
  • Est. Priority Date: 06/25/2007
  • Status: Expired due to Fees
First Claim
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1. An apparatus comprising:

  • a substrate including at least one circuit element;

    a bottom electrode and a first conductive layer sequentially formed over the substrate;

    a strained intrinsic layer formed over the first conductive layer;

    a second conductive layer formed over the strained intrinsic layer; and

    an upper electrode formed over the second conductive layer.

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