ID label, ID tag, and ID card

• US 7,728,734 B2
• Filed: 12/17/2008
• Issued: 06/01/2010
• Est. Priority Date: 02/04/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Arai, Yasuyuki, Akiba, Mai, Kanno, Yohei, Tachimura, Yuko
• Primary Examiner(s): TWEEL JR, JOHN ALEXANDER
• Application Number:
  US12/336,611
• Publication Number:
  US 20090128338A1
• Time in Patent Office: 531 Days
• Field of Search: 340/572.7, 340/572.8, 340/572.1, 235/487, 235/492
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags

Abstract

In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to a decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.

Claims

1. An article comprising:

an antenna;

an integrated circuit device operationally connected to the antenna; and

a filling layer provided around the antenna,

wherein an anisotropic conductive film is included in a connection between the integrated circuit device and the antenna,

wherein a resin is used as the filling layer, and wherein a filler is included in the filling layer.

2. The article according to claim 1, wherein the integrated circuit device is a thin film integrated circuit device comprising a thin film transistor.

3. The article according to claim 1, wherein said article is an ID label.

4. The article according to claim 1, wherein said article is an ID card.

5. The article according to claim 1, wherein said article is an ID tag.

6. The article according to claim 1 further comprising a separator attached to the filling layer with an adhesive material layer interposed therebetween.

7. The article according to claim 1, wherein a coefficient of thermal expansion of the filling layer including the filler is less than or equal to twice a coefficient of thermal expansion of a conductive material of the antenna.

8. The article according to claim 1, wherein the filler functions to decrease or increase a coefficient of thermal expansion of the filling layer and reduces a difference in coefficient of thermal expansion between the filling layer and a conductive material of the antenna or a film forming the thin film transistor.

9. The article according to claim 1, wherein a shape of the filler is spherical or column-shaped.

10. The article according to claim 1,

wherein a protective film comprises at least one of silicon oxide layer, silicon nitride layer, SiOxNy (x>

y) layer, and SiNxOy (x>

y) layer

wherein the protective film is formed at least above or below the integrated circuit device.

11. The article according to claim 1, wherein at least one of hydrogen and halogen is included in a semiconductor film of the integrated circuit device at a concentration comprised between 1×

10¹⁹ and 5×

10²⁰ cm<sup>−

3</sup>.

12. The article according to claim 1, wherein the integrated circuit device is a thin film integrated circuit, wherein a thickness of the thin film integrated circuit device is comprised between 0.1 and 3 μ

m.

13. The article according to claim 1, wherein the antenna comprises a material selected from the group consisting of Ag, Au, Al, Cu, Zn, Sn, Ni, Cr, Fe, Go, Ti, and a combination thereof.

14. The article according to claim 1, wherein the resin is a material selected from the group consisting of a photosensitive organic material, a non-photosensitive organic material, and a heat-resistant organic resin.

15. The article according to claim 1, wherein the filler includes a material selected from the group consisting of silica (SiO₂), alumina (Al₂O₃), boron nitride (BN), magnesia (magnesium oxide), aluminum nitride (AlN), silicon nitride, glass fiber, silicon oxide, carbon fiber, calcium carbonate, talc (talcan), mica, silver powder, copper powder, nickel powder, and copper powder coated with silver.

16. The article according to claim 1, wherein the adhesive material layer includes a material selected from the group consisting of a cyanoacrylate material, a vinyl acetate resin emulsion, a rubber material, a vinyl chloride resin material, a vinyl acetate solution material, an epoxy material, and a hot-melt (thermal melting type) material.

17. The article according to claim 6, wherein the separator includes a material selected from the group consisting of paper, synthetic paper, plastic, PET, polypropylene, polyethylene, polystyrene, nylon, and an inorganic material.

21. The article according to claim 1, wherein the filler is included in the integrated circuit device.

23. The article according to claim 1 further comprising a non-conductive adhesive material between the integrated circuit device and a substrate of the antenna.

18. An article comprising:

a substrate;

an antenna over the substrate;

an integrated circuit device operationally connected to the antenna;

a connecting pad operationally connecting the antenna and the integrated circuit;

a filling layer provided around the antenna; and

a wiring operationally connecting the integrated circuit device and the antenna,

wherein an anisotropic conductive film is included in a connection between the integrated circuit device and the connecting pad,

wherein a resin is used as the filling layer, and

wherein a filler is included in the filling layer.

19. The article according to claim 18, wherein the integrated circuit device is a thin film integrated circuit device comprising a thin film transistor.

20. The article according to claim 18, wherein a coefficient of thermal expansion of the filling layer including the filler is less than or equal to twice a coefficient of thermal expansion of a conductive material of the antenna.

22. The article according to claim 18, wherein the filler is included in the integrated circuit device.

24. The article according to claim 18 further comprising a non-conductive adhesive material between the integrated circuit device and a substrate of the antenna.