Apparatus and method of testing singulated dies

• US 7,733,106 B2
• Filed: 09/15/2006
• Issued: 06/08/2010
• Est. Priority Date: 09/19/2005
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A., Eldridge, Benjamin N., Khandros, Igor Y., Dozier, Thomas H. II, Hsu, David S.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): ISLA RODAS, RICHARD
• Application Number:
  US11/532,494
• Publication Number:
  US 20070063721A1
• Time in Patent Office: 1,362 Days
• Field of Search: 324754-765, 324/158.1
• US Class Current: 324/750.14
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Abstract

An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.

Claims

1. A die carrier apparatus comprising:

a carrier configured to receive a plurality of singulated dies thereon;

a base; and

a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,

wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,

the first interface device comprising;

a plurality of resilient probes disposed within the enclosure on a first surface of the first interface device and patterned to contact the plurality of singulated dies when disposed on the carrier,

a first electrical interface disposed outside of the enclosure on a second surface of the first interface device opposite the first surface, the first electrical interface being directly opposite the plurality of resilient probes, and

electrical connections between ones of the probes and the first electrical interface.

2. The die carrier apparatus of claim 1, wherein the carrier comprises a generally flat surface, wherein the probes are configured to contact singulated dies disposed on the flat surface of the carrier.

3. The die carrier apparatus of claim 2, wherein the probes are configured to hold the singulated dies in place on the flat surface of the carrier.

4. The die carrier apparatus of claim 1, wherein the first electrical interface is configured to connect electrically to a tester.

5. The die carrier apparatus of claim 1, wherein the die carrier apparatus is configured to receive as an attachment a second interface device, the second interface device comprising:

first electrical connectors configured to contact the first electrical interface, and

a second electrical interface,

wherein ones of the first electrical connectors are electrically connected to the second electrical interface.

6. The die carrier apparatus of claim 5, wherein the second electrical interface is configured to connect electrically to a tester.

7. The die carrier apparatus of claim 6, wherein the die carrier apparatus is configured to receive as an attachment any one of a plurality of second interface devices, wherein each second electrical interface of each of the second interface devices comprises terminals having a different number, location, or signal assignment to connect electrically to a different tester configuration.

8. The die carrier apparatus of claim 7, wherein each second electrical interface is configured to connect electrically to a different probe card.

9. The die carrier apparatus of claim 7, wherein each second electrical interface is configured to connect electrically to a different test head.

10. The die carrier apparatus of claim 1, wherein a coefficient of thermal expansion of the carrier is approximately equal to a coefficient of thermal expansion of the singulated dies.

11. The die carrier apparatus of claim 1, wherein the carrier comprises a material, and the singulated dies comprise the material.

12. The die carrier apparatus of claim 11, wherein the material is a semiconductor material.

13. The die carrier apparatus of claim 12, wherein the material is silicon.

14. The die carrier apparatus of claim 1 further comprising a sealing gasket disposed between the base and the first interface device.

15. The die carrier apparatus of claim 1, wherein the carrier comprises a surface of the base.

16. The die carrier apparatus of claim 1, wherein the terminals of the dies comprise bond pads or packaging terminals.

17. The die carrier apparatus of claim 1, further comprising compression stops disposed on the base.

18. The die carrier apparatus of claim 1, further comprising compression stops disposed on the first interface device.

19. The die carrier apparatus of claim 1, further comprising a means for controlling environmental conditions within the hermetically sealed enclosure.

20. The die carrier apparatus of claim 19, wherein the means for controlling environmental conditions comprises a heater disposed on the base.

21. The die carrier apparatus of claim 19, wherein the means for controlling environmental conditions comprises a mechanism for cooling the dies disposed on the base.

22. The die carrier apparatus of claim 1, further comprising a means for storing information.

23. The die carrier apparatus of claim 22, wherein the means for storing information comprises a digital memory disposed on the base.

24. The die carrier apparatus of claim 1, wherein the carrier comprises a cavity that is sized to receive the plurality of singulated dies.

25. The die carrier apparatus of claim 1, wherein the carrier further comprises a component selected from an electrostatic charge mechanism, an adhesive, a clamp, and a tacky or a sticky film to hold the plurality of singulated dies on the carrier.

26. The die carrier apparatus of claim 1, wherein the mechanical engagement is selected from a bolt, a screw, and a clamp.

27. The die carrier apparatus of claim 1, wherein the resilient probes are elongate.

28. The die carrier apparatus of claim 1, further comprising an alignment mark disposed on the carrier.

29. A die carrier apparatus comprising:

a carrier configured to receive a plurality of singulated dies thereon;

a base; and

a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,

wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,

the first interface device comprising;

a plurality of probes disposed within the enclosure and patterned to contact the plurality of singulated dies when disposed on the carrier,

a first electrical interface disposed outside of the enclosure, and

electrical connections between ones of the probes and the first electrical interface,

wherein the die carrier apparatus is configured to receive as an attachment a second interface device, the second interface device comprising;

first electrical connectors configured to contact the first electrical interface, and

a second electrical interface,

wherein ones of the first electrical connectors are electrically connected to the second electrical interface,

wherein the second interface device is attached to the die carrier apparatus with a mechanical engagement that selectively and releasably tightens the second interface device to the die carrier apparatus in a manner that allows the second interface device and the die carrier apparatus to be placed in and removed from the testing system while being tightened together as a single unit.

30. A die carrier apparatus comprising:

a carrier configured to receive a plurality of singulated dies thereon;

a base; and

a first interface device attached to the base with a mechanical engagement that selectively and releasably tightens the first interface device to the base in a manner that allows the first interface device and the base to be placed in and removed from a testing system while being tightened together as a coupled unit,

wherein the base and the first interface device form a hermetically sealed enclosure in which the carrier is disposed,

the first interface device comprising;

a plurality of probes disposed within the enclosure and patterned to contact the plurality of singulated dies when disposed on the carrier,

a first electrical interface disposed outside of the enclosure,

electrical connections between ones of the probes and the first electrical interface, and

compression stops,

wherein the plurality of probes extend from the first interface device by a distance that is greater than a height of the compression stops.