Method and apparatus for reducing microlens surface reflection

• US 7,733,567 B2
• Filed: 08/11/2005
• Issued: 06/08/2010
• Est. Priority Date: 08/11/2005
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Inventors: Li, Jiutao, Li, Jin, Boettiger, Ulrich C.
• Primary Examiner(s): Mack; Ricky L
• Assistant Examiner(s): Thomas; Brandi N
• Application Number:
  US11/201,291
• Publication Number:
  US 20070035844A1
• Time in Patent Office: 1,762 Days
• Field of Search: 359/619, 359620-624, 359/627, 359/639
• US Class Current: 359/619
• CPC Class Codes: G02B 1/11 Anti-reflection coatings
• CPC Class Codes: G02B 1/118 having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
• CPC Class Codes: G02B 3/0006 Arrays G02B3/02, G02B5/188 take precedence

Abstract

A microlens has a surface with an effective index of refraction close to the index of air to reduce reflection caused by change in indices of refraction from microlens to air. The microlens having an index of refraction approximately the same as that of air is obtained by providing a rough or bumpy lens-air surface on the microlens. Features protrude from the surface of a microlens to create the rough surface and preferably have a length of greater or equal to a wavelength of light and a width of less than a sub-wavelength of light, from about 1/10 to ¼ of the wavelength of light. The features may be of any suitable shape, including but not limited to triangular, cylindrical, rectangular, trapezoidal, or spherical and may be formed by a variety of suitable processes, including but not limited to mask and etching, lithography, spray-on beads, sputtering, and growing.

Claims

1. A pixel array comprising:

a plurality of pixels; and

an array of microlenses over said plurality of pixels, wherein each of said microlenses has a first index of refraction at a bumpy outer layer of said microlens and a second index of refraction inside said microlens, medial to said outer layer, said outer layer of each microlens including a plurality of bumps protruding from the surface of the microlens.

2. The pixel array of claim 1, wherein said at least one microlens has an index of refraction approximately the same as the index of refraction of air at the air-microlens surface of said microlens.

3. The pixel array of claim 1, wherein said at least one microlens has a rough air-microlens surface.

4. The pixel array of claim 3, wherein said air-microlens surface has a plurality of features on said air-microlens surface.

5. The pixel array of claim 4, wherein said features have a height that is at least a wavelength of light.

6. The pixel array of claim 4, wherein said features have a width that is less than a sub-wavelength of light.

7. The pixel array of claim 4, wherein said features have a trapezoidal cross-section in the x- and z-axes of said features.

8. The pixel array of claim 4, wherein said features have a triangular cross-section in the x- and z-axes of said features.

9. The pixel array of claim 4, wherein said features have a rectangular cross-section in the x- and z-axes of said features.

10. The pixel array of claim 4, wherein said features have a spherical shape.

11. An imager device comprising:

a plurality of pixels; and

an array of microlenses over said plurality of pixels, wherein each of said microlenses has a surface from which protrudes a plurality of bumps.

12. The imager device of claim 11, wherein said bumps have a height that is at least a wavelength of light.

13. The imager device of claim 11, wherein said bumps have a width that is less than a sub-wavelength of light.

14. The imager device of claim 11, wherein said bumps have a trapezoidal cross-section in the x- and z-axes of said features.

15. The imager device of claim 11, wherein said bumps have a triangular cross-section in the x- and z-axes of said features.

16. The imager device of claim 11, wherein said bumps have a rectangular cross-section in the x- and z-axes of said features.

17. The imager device of claim 11, wherein said bumps have a spherical shape.

18. An imager structure comprising:

a plurality of pixels formed in a substrate;

at least one planar layer formed over said plurality of pixels; and

a plurality of microlenses over said plurality of pixels having a first index of refraction, each microlens having a bumpy refractive layer at a top surface of said microlenses having a second index of refraction, the bumpy refractive layer comprising a plurality of bumps protruding from the top surface of each microlens.

19. The imager device of claim 18, wherein said second index of refraction is closer to the index of refraction of air than said first index of refraction.

20. The imager device of claim 19, wherein said refractive layer comprises a plurality of structures.

21. The imager device of claim 19, wherein said plurality of structures have a height that is at least a wavelength of light and a width that is less than a sub-wavelength of light.

22. A method of making a pixel array comprising:

forming a plurality of pixels in a substrate;

forming a plurality of microlenses over said plurality of pixels; and

forming a plurality of bumps on protruding from a top surface of each of said microlenses.

23. The method of claim 22, wherein said step of forming a plurality of bumps further comprises forming bumps having rectangular cross-sections.

24. The method of claim 22, wherein said step of forming a plurality of bumps further comprises forming bumps having trapezoidal cross-sections.

25. The method of claim 22, wherein said step of forming a plurality of bumps further comprises forming cylindrical bumps.

26. The method of claim 22, wherein said step of forming a plurality of bumps further comprises forming spherical bumps.

27. The method of claim 22, wherein said step of forming a plurality of bumps further comprises forming bumps having triangular cross-sections.

28. The method of claim 22, wherein said step of forming a plurality of bumps comprises a photolithography process.

29. The method of claim 22, wherein said step of forming a plurality of bumps comprises a ion etching process.

30. The method of claim 22, wherein said step of forming a plurality of bumps comprises a plasma vapor deposition process.

31. The method of claim 22, wherein said step of forming a plurality of bumps comprises a spin developing process.

32. The method of claim 31, wherein said step of forming a plurality of bumps comprises a spraying process.