Lens, manufacturing method thereof and light emitting device package using the same

• US 7,733,573 B2
• Filed: 09/25/2007
• Issued: 06/08/2010
• Est. Priority Date: 09/28/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation)
• Inventors: Hurh, Hoon, Kim, Yong Suk, Kim, Geun Ho, Won, Yu Ho
• Primary Examiner(s): Sugarman; Scott J
• Assistant Examiner(s): PATEL, VIPIN
• Application Number:
  US11/902,779
• Publication Number:
  US 20080088953A1
• Time in Patent Office: 987 Days
• Field of Search: 359/811, 359/642, 257/79, 257/80, 257 98-100
• US Class Current: 359/642
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.

Claims

1. A method of manufacturing a lens comprising:

preparing at least one surface mount portion having a first part and a second part to be fixed on the lens,

fixing a first part of the surface mount portion on a first mold, wherein the first mold is divided into at least two portions, by coupling the at least two portions while the surface mount portion is disposed at an inside of the first mold,

fixing a second mold on the first mold and injecting a lens material into the second mold; and

processing the lens material to form the lens and removing the first mold and the second mold.

2. The method according to claim 1, wherein the lens material is formed of thermosetting resin such as silicone, epoxy, PC, and PMMA or thermoplastic resin, and

the lens material is processed by cooling the lens material.

3. The method according to claim 1, wherein the first mold is formed of metal which is not mixed with Au, Ag, Cu, and Al.

4. The method according to claim 1, wherein the second mold is formed of metal which is not mixed with thermosetting resin such as silicone, epoxy, PC, and PMMA or thermoplastic resin.