Installation for processing a substrate
First Claim
1. An installation for processing a substrate having at least one processing station, wherein to hold and/or transport the substrate the installation comprises at least one frame having an annular top part and an annular bottom part with a carrier clamped in said frame between the top and bottom parts thereof, said carrier being adapted to have the substrate secured over substantially its entire surface to the carrier, said processing station comprising a chuck electrode having a surface, the carrier being made of a nonconductive dielectric material having a conductive layer disposed on one side thereof,said carrier being adapted to be removably positioned adjacent said surface of said chuck electrode so that said carrier and said chuck electrode together form an electrostatic chuck device wherein the conductive layer of said carrier and surface of said chuck electrode form two plates of a plate-type capacitor when positioned adjacently and connected to a voltage source.
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Accused Products
Abstract
The invention relates to an installation, in particular a vacuum processing installation for processing a substrate (130), in particular a semiconductor wafer, comprising a processing station. Said installation comprises a frame (110), to which is clamped a carrier (120), for holding and/or transporting the substrate (130), whereby the latter (130) can be fastened by its entire surface to said carrier (120). The processing station preferably comprises a chuck electrode (140) with a flat outer surface (141) and the carrier (120) can be positioned parallel and adjacent to said outer surface (141) of the chuck electrode (140). The carrier is composed in particular of a non-conductive dielectric material and is provided on one side with a conductive layer (122), in such a way that the chuck electrode (140) and the carrier (120) form an electrostatic chuck.
32 Citations
32 Claims
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1. An installation for processing a substrate having at least one processing station, wherein to hold and/or transport the substrate the installation comprises at least one frame having an annular top part and an annular bottom part with a carrier clamped in said frame between the top and bottom parts thereof, said carrier being adapted to have the substrate secured over substantially its entire surface to the carrier, said processing station comprising a chuck electrode having a surface, the carrier being made of a nonconductive dielectric material having a conductive layer disposed on one side thereof,
said carrier being adapted to be removably positioned adjacent said surface of said chuck electrode so that said carrier and said chuck electrode together form an electrostatic chuck device wherein the conductive layer of said carrier and surface of said chuck electrode form two plates of a plate-type capacitor when positioned adjacently and connected to a voltage source.
- 20. A frame structure for holding and/or transporting a substrate, comprising a frame having an annular top part and an annular bottom part and a film carrier clamped in said frame between the top and bottom parts thereof and being adapted to carry said substrate on a surface thereof said film carrier being made of a non-conductive dielectric material having a conductive layer disposed on one side thereof, said frame being conductive at least in a region thereof, said carrier being clamped in said frame so that said conductive layer of said carrier is in contact with said conductive region of the frame.
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23. A method for processing a substrate in a vacuum process installation, wherein:
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a) the substrate, in order to be held and/or transported, is secured over substantially its entire surface to a first planar main surface of a carrier clamped in a frame having an annular top part and an annular bottom part connected to ether to clam said carrier therebetween, b) the carrier is made of a nonconductive dielectric material having a conductive layer disposed at and forming the first main surface thereof, c) a chuck electrode is arranged with a planar outer surface thereof parallel to and adjacent a second planar main surface of the carrier, the second planar main surface being on the opposite side from the first planar main surface, and d) a voltage source is connected between the chuck electrode and the conductive layer of the carrier, such that the carrier and the chuck electrode together form an electrostatic chuck device, said conductive layer of the carrier and the chuck electrode outer surface forming two plates of a plate-type capacitor. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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30. A method for processing a substrate in a vacuum process installation, wherein:
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a) the substrate, in order to be held and/or transported, is secured over substantially its entire surface to a first planar main surface of a carrier clamped in a frame having an annular top part and an annular bottom part connected together to clamp said carrier therebetween, b) the carrier is made of a nonconductive dielectric material having a conductive layer disposed at and forming a second main surface of the carrier opposite said first main surface, c) a chuck electrode is arranged with a planar outer surface thereof parallel to and adjacent the second planar main surface of the carrier, wherein a dielectric layer is arranged between the chuck electrode and the second planar main surface of the carrier, and d) a voltage source is connected between the chuck electrode and the conductive layer of the carrier, such that the carrier, the chuck electrode and the dielectric layer between them together form an electrostatic chuck device, said conductive layer of the carrier and the chuck electrode outer surface forming two plates of a plate-type capacitor. - View Dependent Claims (31, 32)
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Specification