Electromagnetic shielding filter
First Claim
Patent Images
1. An electromagnetic shielding filter, comprising:
- two transparent boards; and
a conductive mesh comprising a plurality of wires, the conductive mesh being sandwiched between the two transparent boards,wherein the plurality of wires comprises a Cu—
Sn—
In alloy comprising 0.15 mass % to 0.25 mass % of Sn and 0.15 mass % to 0.25 mass % of In, andwherein the plurality of wires further comprises an Sn layer or an Ag layer with a thickness of 0.1 μ
m to 1.0 μ
m formed on a periphery thereof.
1 Assignment
0 Petitions
Accused Products
Abstract
An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.
-
Citations
10 Claims
-
1. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh comprising a plurality of wires, the conductive mesh being sandwiched between the two transparent boards, wherein the plurality of wires comprises a Cu—
Sn—
In alloy comprising 0.15 mass % to 0.25 mass % of Sn and 0.15 mass % to 0.25 mass % of In, andwherein the plurality of wires further comprises an Sn layer or an Ag layer with a thickness of 0.1 μ
m to 1.0 μ
m formed on a periphery thereof. - View Dependent Claims (2, 3)
-
-
4. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ
m to 1.0 μ
m,wherein the plurality of wires further comprises a Cu—
Sn—
In alloy comprising 0.15 mass % to 0.25 mass % of Sn and 0.15 mass % to 0.25 mass % of In.
-
-
5. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ
m to 1.0 μ
m,wherein the plurality of wires further comprises a Cu—
Sn—
In alloy comprising 0.15 mass % to 0.25 mass % of Sn.
-
-
6. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ
m to 1.0 μ
m,wherein the plurality of wires further comprises a Cu—
Sn—
In alloy comprising 0.15 mass % to 0.25 mass % of In.
-
-
7. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ
m to 1.0 μ
m,wherein the plurality of wires comprises a Cu—
Ag alloy comprising 1.0 mass % to 5.0 mass % of Ag.
-
-
8. An electromagnetic shielding filter, comprising:
-
two transparent boards; and a conductive mesh comprising a plurality of wires, the conductive mesh being sandwiched between the two transparent boards, wherein the plurality of wires comprises a Cu—
Ag alloy comprising 1.0 mass % to 5.0 mass % of Ag, andwherein the plurality of wires further comprises one of an Sn layer and an Ag layer with a thickness of 0.1 μ
m to 1.0 μ
m formed on a periphery thereof. - View Dependent Claims (9, 10)
-
Specification