Electromagnetic shielding filter

• US 7,737,370 B2
• Filed: 07/30/2007
• Issued: 06/15/2010
• Est. Priority Date: 07/31/2006
• Status: Expired due to Fees

• Current Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Inventors: Komuro, Hiroshi, Ito, Yuzo, Horikoshi, Toshiyuki, Okikawa, Hiroshi, Kuroda, Hiromitsu, Aoyama, Seigi
• Primary Examiner(s): Ngo; Hung V
• Application Number:
  US11/882,089
• Publication Number:
  US 20080047747A1
• Time in Patent Office: 1,051 Days
• Field of Search: 174/377, 174/388, 174/392, 174/389, 313/313
• US Class Current: 174/389
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel

Abstract

An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.

Claims

1. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh comprising a plurality of wires, the conductive mesh being sandwiched between the two transparent boards,

wherein the plurality of wires comprises a Cu—

Sn—

In alloy comprising 0.15 mass % to 0.25 mass % of Sn and 0.15 mass % to 0.25 mass % of In, and

wherein the plurality of wires further comprises an Sn layer or an Ag layer with a thickness of 0.1 μ

m to 1.0 μ

m formed on a periphery thereof.

2. The electromagnetic shielding filter according to claim 1, wherein the two transparent boards comprise a thickness of 0.01 mm to 0.5 mm.

3. The electromagnetic shielding filter according to claim 1, wherein the plurality of wires further comprises a diameter of not less than 10 μ

m and less than 25 μ

m, and

wherein the conductive mesh further comprises an aperture of 85% to 95%.

4. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ

m to 1.0 μ

m,

wherein the plurality of wires further comprises a Cu—

Sn—

In alloy comprising 0.15 mass % to 0.25 mass % of Sn and 0.15 mass % to 0.25 mass % of In.

5. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ

m to 1.0 μ

m,

wherein the plurality of wires further comprises a Cu—

Sn—

In alloy comprising 0.15 mass % to 0.25 mass % of Sn.

6. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ

m to 1.0 μ

m,

wherein the plurality of wires further comprises a Cu—

Sn—

In alloy comprising 0.15 mass % to 0.25 mass % of In.

7. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh sandwiched between the two transparent boards, the conductive mesh comprising a plurality of wires, the plurality of wires comprising a periphery layer disposed on a periphery of the plurality of wires, the periphery layer comprising one of Sn and Ag and having a thickness in a range from 0.1 μ

m to 1.0 μ

m,

wherein the plurality of wires comprises a Cu—

Ag alloy comprising 1.0 mass % to 5.0 mass % of Ag.

8. An electromagnetic shielding filter, comprising:

two transparent boards; and

a conductive mesh comprising a plurality of wires, the conductive mesh being sandwiched between the two transparent boards,

wherein the plurality of wires comprises a Cu—

Ag alloy comprising 1.0 mass % to 5.0 mass % of Ag, and

wherein the plurality of wires further comprises one of an Sn layer and an Ag layer with a thickness of 0.1 μ

m to 1.0 μ

m formed on a periphery thereof.

9. The electromagnetic shielding filter according to claim 8, wherein the two transparent boards comprise a thickness of 0.01 mm to 0.5 mm.

10. The electromagnetic shielding filter according to claim 8, wherein the plurality of wires further comprises a diameter of not less than 10 μ

m and less than 25 μ

m, and

wherein the conductive mesh further comprises an aperture of 85% to 95%.