User interface for wafer data analysis and visualization

• US 7,738,693 B2
• Filed: 05/30/2003
• Issued: 06/15/2010
• Est. Priority Date: 12/24/2002
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Luque, Jorge
• Primary Examiner(s): Carter; Aaron W
• Application Number:
  US10/452,248
• Publication Number:
  US 20040119749A1
• Time in Patent Office: 2,573 Days
• Field of Search: 382141-152, 250306-311, 250/223, 348 86- 95, 348125-134, 700 95-212, 298/33, 438/16, 3562371-2376, 356426-431, 715716-726
• US Class Current: 382/145
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.

Claims

1. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system, comprising:

providing a graphical selection control for selecting a spatial region of a wafer map including wafer measurement data to be analyzed, wherein the spatial region of the wafer map is less than an entirety of the wafer map and is defined without regard to specific locations associated with wafer measurement data on the wafer map;

providing a control for selecting a first set of wafer measurement data corresponding to a selected spatial region of the wafer map, wherein the first set of wafer measurement data defines a first operand in a mathematical operation;

providing a control for selecting a second set of wafer measurement data also corresponding to the selected spatial region of the wafer map, wherein the second set of wafer measurement data defines a second operand in the mathematical operation;

providing a control for selecting a mathematical operator to be applied between the first set of wafer measurement data and the second set of wafer measurement data in the mathematical operation;

providing a control for performing the mathematical operation in accordance with the selected mathematical operator between the first set of wafer measurement data and the second set of wafer measurement data, the mathematical operation creating a result set of wafer data for the selected spatial region of the wafer map; and

displaying the result set of wafer data.

2. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, wherein the first set of wafer measurement data and the second set of wafer measurement data are associated with a common wafer.

3. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, wherein the first set of wafer measurement data and the second set of wafer measurement data are associated with different wafers.

4. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, wherein the first set of wafer measurement data and the second set of wafer measurement data represent wafer thickness measurement data.

5. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, wherein the first set of wafer measurement data and the second set of wafer measurement data represent a common subset of wafer measurement data, the common subset of wafer measurement data being associated with the selected spatial region of the wafer map.

6. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 5, further comprising:

providing a subset selection control for selecting the common subset of wafer measurement data.

7. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 6, wherein the subset selection control provides for removal of specific wafer measurement data from one of the first set of wafer measurement data, the second set of wafer measurement data, and both the first and second sets of wafer measurement data.

8. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, wherein displaying the result set of wafer data includes displaying a wafer map, the wafer map illustrating the result set of wafer data as a function of location on a wafer surface, differing magnitudes within the result set of wafer data being illustrated using one of a color scale and a monochrome scale.

9. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, further comprising:

providing a control for saving the result set of wafer data.

10. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, further comprising:

providing a control for printing a report of the result set of wafer data.

11. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, further comprising:

providing a control for electronically transferring the result set of wafer data.

12. A process for generating a graphical user interface for analyzing wafer measurement data on a computer system as recited in claim 1, further comprising:

providing a control for changing a unit of measure for displaying the result set of wafer data.

13. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system, comprising:

providing a control for selecting the collection of wafer measurement data;

providing a control for performing an evaluation of the collection of wafer measurement data, the evaluation creating a set of evaluation results, wherein the control for performing the evaluation of the collection of wafer measurement data includes a control for selecting a spatial region of a wafer map including a subset of wafer measurement data to be evaluated, wherein the spatial region of the wafer map is either an arbitrary half of the wafer map, an arbitrary region outwardly extendable from a center of the wafer map, or an annular region selectable at an arbitrary distance from the center of the wafer map, and wherein the spatial region of the wafer map is less than an entirety of the wafer map and is defined without regard to specific locations associated with wafer measurement data on the wafer map; and

displaying the set of evaluation results.

14. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, further comprising:

providing a control for adding a set of wafer measurement data to the collection of wafer measurement data.

15. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, further comprising:

providing a control for removing a set of wafer measurement data from the collection of wafer measurement data.

16. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, further comprising:

providing a control for generating the collection of wafer measurement data from a group of wafer measurement data, the group of wafer measurement data including a common type of data measurement for multiple wafers.

17. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, further comprising:

providing a control for generating multiple collections of wafer measurement data from a group of wafer measurement data, the group of wafer measurement data including different types of data measurements for multiple wafers, a separate collection of wafer measurement data being generated for each of the different types of data measurements, each separate collection of wafer measurement data including wafer measurement data for each of the multiple wafers.

18. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, further comprising:

providing a control for saving changes to the collection of wafer measurement data.

19. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, wherein the control for performing evaluation of the collection of wafer measurement data includes a control for selecting a quantity to be evaluated, the quantity being selected from a set of options including a mean, a standard deviation about the mean, a range between a maximum value and a minimum value, the maximum value, and the minimum value.

20. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, wherein displaying the set of evaluation results includes providing a graphical display of the set of evaluation results for each set of wafer measurement data in the collection of wafer measurement data.

21. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 20, wherein the graphical display includes a display of control limits, the control limits representing a selected number of standard deviations about a mean of a quantity being displayed in the set of evaluation results.

22. A process for generating a graphical user interface for managing and evaluating a collection of wafer measurement data on a computer system as recited in claim 13, wherein displaying the set of evaluation results includes displaying statistical values associated with the set of evaluation results, the statistical values including a mean, a standard deviation about the mean, a range between a maximum value and a minimum value, the maximum value, and the minimum value.

23. A computer implemented process for controlling and performing analysis of wafer measurement data, comprising:

operating a computer to provide a graphical user interface, the graphical user interface providing a graphical selection control for selecting a spatial region of a wafer map including a subset of wafer measurement data for analysis, wherein the spatial region of the wafer map is less than an entirety of the wafer map and is defined without regard to specific locations associated with wafer measurement data within the subset of wafer measurement data;

operating the computer to perform analysis of the subset of wafer measurement data within the spatial region of the wafer map to create a set of analysis results; and

operating the computer to provide a display of the set of analysis results, the display being presented in the graphical user interface.

24. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 23, wherein the graphical selection control for selecting the spatial region of the wafer map is a cross-section selection control, the cross-section selection control allowing the wafer measurement data across a diameter of a wafer to be selected as the subset of wafer measurement data for analysis.

25. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 24, wherein the set of analysis results includes a mean, a standard deviation about the mean, an range between a maximum value and a minimum value, the maximum value, and the minimum value.

26. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 24, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data across the diameter of the wafer.

27. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 26, wherein differing magnitudes within the subset of wafer measurement data are illustrated using one of a color scale and a monochrome scale.

28. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 23, wherein the graphical selection control for selecting the spatial region of the wafer map is a radial selection control, the radial selection control allowing the wafer measurement data across a radius of a wafer to be selected as the subset of wafer measurement data for analysis.

29. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 28, wherein the set of analysis results includes a mean, a standard deviation about the mean, an range between a maximum value and a minimum value, the maximum value, and the minimum value.

30. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 28, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data across the radius of the wafer.

31. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 30, wherein differing magnitudes within the subset of wafer measurement data are illustrated using one of a color scale and a monochrome scale.

32. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 23, wherein the graphical selection control for selecting the spatial region of the wafer map is an angular selection control, the angular selection control allowing the wafer measurement data at a constant distance about a center of a wafer to be selected as the subset of wafer measurement data for analysis.

33. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 32, wherein the set of analysis results includes a mean, a standard deviation about the mean, an range between a maximum value and a minimum value, the maximum value, and the minimum value.

34. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 32, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data at the constant distance about the center of the wafer.

35. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 34, wherein differing magnitudes within the subset of wafer measurement data are illustrated using one of a color scale and a monochrome scale.

36. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 23, wherein the set of analysis results includes a set of Gaussian analysis results based on the subset of wafer measurement data.

37. A computer implemented process for controlling and performing analysis of wafer measurement data as recited in claim 36, wherein the display of the set of analysis results includes a graphical display of the Gaussian analysis results, the graphical display being a histogram represented by a number of bars, each of the number of bars representing a number of wafer measurement data values within a varying number of standard deviations about a mean value, the graphical display further including an ideal Gaussian distribution plot based on the subset of wafer measurement data.

38. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data, comprising:

program instructions for providing a graphical user interface, the graphical user interface providing a graphical selection control for selecting a spatial region of a wafer map including a subset of wafer measurement data for analysis, wherein the spatial region of the wafer map is less than an entirety of the wafer map and is defined without regard to specific locations associated with wafer measurement data within the subset of wafer measurement data;

program instructions for performing analysis of the subset of wafer measurement data to create a set of analysis results; and

program instructions for providing a display of the set of analysis results, the display being presented in the graphical user interface.

39. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 38, wherein the graphical selection control for selecting the spatial region of the wafer map is a cross-section selection control, the cross-section selection control allowing the wafer measurement data across a diameter of a wafer to be selected as the subset of wafer measurement data for analysis.

40. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 39, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data across the diameter of the wafer.

41. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 38, wherein the graphical selection control for selecting the spatial region of the wafer map is a radial selection control, the radial selection control allowing the wafer measurement data across a radius of a wafer to be selected as the subset of wafer measurement data for analysis.

42. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 41, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data across the radius of the wafer.

43. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 38, wherein the graphical selection control for selecting the spatial region of the wafer map subset is an angular selection control, the angular selection control allowing the wafer measurement data at a constant distance about a center of a wafer to be selected as the subset of wafer measurement data for analysis.

44. A computer readable storage medium containing program instructions for controlling and performing analysis of wafer measurement data as recited in claim 43, wherein the display of the set of analysis results includes a graphical display of the subset of wafer measurement data at the constant distance about the center of the wafer.