Light emitting device package and method of manufacturing the same

• US 7,738,764 B2
• Filed: 02/16/2007
• Issued: 06/15/2010
• Est. Priority Date: 02/28/2006
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Electronics, Inc. (LG Corporation), LG Innotek Company Limited (LG Corporation)
• Inventors: Kim, Geun Ho
• Primary Examiner(s): Le; Uyen-Chau N
• Assistant Examiner(s): Chu; Chris H
• Application Number:
  US11/707,140
• Publication Number:
  US 20070200131A1
• Time in Patent Office: 1,215 Days
• Field of Search: 257/81, 257/93
• US Class Current: 385/147
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device package and a method of manufacturing the same are disclosed. The light emitting device package includes a package structure, two diffusion layers formed on the package structure such that the two diffusion layers are electrically separated from each other, and first and second electrodes insulated from the package structure by an insulation film. The first and second electrodes are electrically connected with the two diffusion layers, respectively.

Claims

1. A light emitting device package, comprising:

a package structure having a first surface, a second surface and a mounting groove in the first surface;

at least one electrically conductive diffusion region located on the package structure; and

a first electrode and a second electrode insulated from the package structure by an insulation film, at least one of the first and second electrodes being electrically connected with the at least one electrically conductive diffusion region,

wherein the first electrode and second electrode each include an upper electrode portion located on the first surface of the package structure electrically connected to a lower electrode portion located on the second surface of the package structure, and

wherein the first surface and the second surface are located on opposite sides of the package structure.

2. The light emitting device package according to claim 1, wherein the package structure includes at least one of silicon, ceramic, and plastic.

3. The light emitting device package according to claim 1, wherein the mounting groove has an inclined side surface.

4. The light emitting device package according to claim 3, further comprising:

a light emitting device disposed in the mounting groove, the light emitting device being electrically connected with the first electrode and the second electrode.

5. The light emitting device package according to claim 4, further comprising:

a molding part arranged to fill a space defined between the light emitting device and the mounting groove, and the molding part arranged to seal the package structure.

6. The light emitting device package according to claim 5, wherein the molding part comprises a mixture including composite resin powder and fluorescent powder.

7. The light emitting device package according to claim 4, wherein the first electrode and the second electrode comprise a material having high reflexibility.

8. The light emitting device package according to claim 1, wherein the insulation film is formed substantially on an entire surface of the package structure excluding a region where the at least one electrically conductive diffusion region is formed.

9. The light emitting device package according to claim 1, where the at least one electrically conductive diffusion region located on the package structure includes two diffusion regions located on the package structure.

10. The light emitting device package according to claim 9, wherein the two diffusion regions have a common polarity.

11. The light emitting device package according to claim 10, wherein the two diffusion regions have a polarity different from that of a region of the package structure where the diffusion regions are not formed.

12. The light emitting device package according to claim 1,

wherein the first electrode and second electrode each include a side electrode potion connected to an outer side of the package structure, the side electrode potion connecting the upper electrode portion and lower electrode portion.

13. The light emitting device package according to claim 1, wherein the at least one diffusion region is located on the second surface of the package structure.

14. The light emitting device package according to claim 1, wherein the first surface and the second surface are substantially parallel.

15. A light emitting device package, comprising:

a package structure having a mounting groove, an upper surface and a lower surface, the lower surface being opposite to the upper surface;

at least one diffusion layer formed on the package structure; and

a pair of electrodes insulated from the package structure by an insulation film, wherein

one of the pair of electrodes is electrically connected with a corresponding one of the at least one diffusion layer, and

each of the pair of electrodes include electrode portions located on the upper surface and the lower surface of the package structure.

16. The light emitting device package according to claim 15,

wherein each of the pair of electrodes include a side electrode potion connected to an outer side of the package structure, each side electrode potion connecting the respective electrode portions located over the upper surface and the lower surface of the package structure.

17. The light emitting device package according to claim 15, further comprising a light emitting diode disposed in the mounting groove.

18. The light emitting device package according to claim 15, wherein the at least one diffusion region is located on the lower surface of the package structure.

19. The light emitting device package according to claim 15, wherein the upper surface and the lower surface are substantially parallel.

20. A method of manufacturing a light emitting device package, comprising:

applying a mask on a first surface and a second surface of a substrate;

exposing the substrate to light;

selectively etching the substrate and forming a mounting groove and through-holes;

forming at least one diffusion layer on the first surface of the substrate; and

forming a first electrode and a second electrode on the first surface and the second surface, the first electrode and the second electrode being connected via the through-holes such that the first electrode and the second electrode are insulated from the substrate and are electrically connected with the at least one diffusion layer; and

bonding a light emitting device to the mounting groove via a conductive bonding agent such that the light emitting device is electrically connected with the first electrode and the second electrode.

21. The method according to claim 20, the step of selectively etching the substrate and forming a mounting groove comprising:

forming an inclined side surface on the mounting groove.

22. The method according to claim 20, wherein the light emitting package includes plural light emitting packages, the method further comprising:

separating the plural light emitting device packages from each other.

23. The method according to claim 22,

wherein the etching the substrate is performed by a wet-type etching fashion through a bulk micro machining process to form the through-holes through the substrate such that the light emitting device packages are divided from each other by the through-holes and to form the mounting groove in each light emitting device package.