Integrated circuit package having integrated faraday shield

• US 7,741,567 B2
• Filed: 05/19/2008
• Issued: 06/22/2010
• Est. Priority Date: 05/19/2008
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Drouard, Jean-Francois, Beddingfield, Stanley Craig
• Primary Examiner(s): Ngo; Hung V
• Application Number:
  US12/123,115
• Publication Number:
  US 20090284947A1
• Time in Patent Office: 764 Days
• Field of Search: 174/377, 174/386, 361/818, 361/816, 257/659, 257/686
• US Class Current: 174/386
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1088 Arrangements to limit the height of the assembly
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A packaged integrated circuit (IC) (100) includes a first substrate (110) including a first plurality of layers and first circuit coupling features (112) at an upper surface of the first substrate (110). The first plurality of layers include a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layers includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.

Claims

1. A packaged integrated circuit, comprising:

a first electronic substrate comprising a first plurality of layers and at least a first circuit coupling feature at an upper surface of said first electronic substrate, said first plurality of layers comprising at least a first electromagnetic interference (EMI) shielding layer;

a second electronic substrate having an upper surface attached to a lower surface of said first electronic substrate by one or more portions of an electrically conductive adhesive material, said second electronic substrate comprising a second plurality of layers and at least a second circuit coupling feature at a lower surface of said second electronic substrate, said first plurality of layer comprising at least a second EMI shielding layer; and

at least one functional die disposed between said first and said second electronic substrate and functionally coupled to at least one among said first and said second circuit coupling features,

wherein each of said adhesive material portions electrically couples said first and said second shielding layers.

2. The integrated circuit of claim 1, wherein said second electronic substrate further comprises at least one terminal on said upper surface of said second electronic substrate electrically coupled to said second shielding layer.

3. The integrated circuit of claim 2, wherein said first electronic substrate further comprises at least one terminal on said lower surface of said first electronic substrate electrically coupled to said first shielding layer.

4. The integrated circuit of claim 2, wherein one of said first plurality of layers at a lower surface of said first electronic substrate comprises said first shielding layer.

5. The integrated circuit of claim 1, wherein said adhesive is formed in a bonding pattern, said bonding pattern defining at least one region between said first and said second electronic substrates free of said adhesive.

6. The integrated circuit of claim 1, wherein at least two functional die are disposed between said first and said second electronic substrates, wherein said adhesive is formed in a bonding pattern, and wherein said adhesive in said bonding pattern electromagnetically surrounds at least one of said functional die.

7. The integrated circuit of claim 1, wherein said adhesive is a polymer-comprising conductive adhesive.

8. A method for packaging an integrated circuit, comprising:

providing a first electronic substrate comprising a first plurality of layers and at least a first circuit coupling feature at an upper surface of said first electronic substrate, said first plurality of layer comprising at least a first electromagnetic interference SEMI) shielding layer;

providing a second electronic substrate comprising a second plurality of layers and at least a second circuit coupling feature at a lower surface of said second electronic substrate, said second plurality of layers comprising at least a second EMI shielding layer;

attaching at least one functional die to a lower surface of said first electronic substrate or an upper surface of said second electronic substrate and functionally coupling said functional die to at least one among said first and said second circuit coupling features; and

attaching said upper surface of said second electronic substrate to said lower surface of said first electronic substrate by one or more portions of an electrically conductive adhesive, wherein each of said adhesive portions electrically couple said first and said second shielding layers.

9. The method of claim 8, wherein said attaching step further comprises placing said adhesive in contact with at least one terminal on said upper surface of said second electronic substrate electrically coupled to said second shielding layer.

10. The method of claim 9, wherein said attaching step further comprises placing said adhesive in contact with at least one terminal on said lower surface of said first electronic substrate electrically coupled to said first shielding layer.

11. The method of claim 9, wherein one of said first plurality of layers at a lower surface of said first electronic substrate comprises said first shielding layer.

12. The method of claim 8, wherein said attaching step further comprises placing said adhesive on one of said first and said second electronic substrates in a bonding pattern, said bonding pattern defining at least one region between said first and said second electronic substrates free of said adhesive.

13. The method of claim 8, wherein at least two functional die are disposed between said first and said second electronic substrates, wherein said adhesive is formed in a bonding pattern, and wherein said adhesive in said bonding pattern electromagnetically surrounds at least one of said functional die.

14. The method of claim 12, wherein said adhesive is a polymer-comprising conductive adhesive.

15. A integrated circuit packaging system, comprising:

at least one top package for packaging at least one top functional die, said top package comprising a plurality of top package leads coupled to said top functional die and extending from a lower surface of said top package; and

a bottom package for packaging at least one bottom functional die, said bottom package comprising;

a first electronic substrate comprising a first plurality of layers and a plurality of electrical terminals at an upper surface of said first electronic substrate for receiving said top leads, said first plurality of layer comprising at least a first electromagnetic interference (EMI) shielding layer, and

a second electronic substrate having an upper surface attached to a lower surface of said first electronic substrate by one or more portions of an electrically conductive polymer comprising adhesive, said second electronic substrate comprising a second plurality of layers and a plurality of bottom package leads at a lower surface of said second electronic substrate, said second plurality of layers comprising at least a second EMI shielding layer,

wherein said bottom die is disposed between said first and said second electronic substrate, wherein said adhesive portions electrically couple said first and said second shielding layers, and wherein said top and said bottom dies are functionally coupled to said bottom leads.

16. The system of claim 15, wherein said second electronic substrate further comprises at least one terminal on said upper surface of said second electronic substrate electrically coupled to said second shielding layer.

17. The system of claim 16, wherein said first electronic substrate further comprises at least one terminal on said lower surface of said first electronic substrate electrically coupled to said first shielding layer.

18. The system of claim 16, wherein a one of said first plurality of layers at a lower surface of said first electronic substrate comprises said first shielding layer.

19. The system of claim 15, wherein at least two bottom functional die are disposed between said first and said second electronic substrates, wherein said adhesive is formed in a bonding pattern, and wherein said adhesive in said bonding pattern electromagnetically surrounds at least one of said bottom functional die.

20. The system of claim 19, wherein said adhesive in said bonding pattern continuously surrounds said one bottom functional die.