Physiological sensor with booster circuit

• US 7,741,592 B1
• Filed: 12/09/2008
• Issued: 06/22/2010
• Est. Priority Date: 12/09/2008
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Somanetics Corporation (Medtronic Plc)
• Inventors: Gonopolskiy, Oleg, Anderson, Arik, Widman, Ronald A., Barrett, Bruce J.
• Primary Examiner(s): Sohn; Seung C
• Application Number:
  US12/330,840
• Publication Number:
  US 20100140451A1
• Time in Patent Office: 560 Days
• Field of Search: 250/214.1, 250/214.R, 250/214.A, 600/340, 600/323
• US Class Current: 250/214.00A
• CPC Class Codes: A61B 5/0059 using light, e.g. diagnosis by transillumination, diascopy, fluorescence A61B5/0093, A61B5/1455, A61B5/02416 and A61B5/0261 take precedence
• CPC Class Codes: A61B 5/1455 using optical sensors, e.g. spectral photometrical oximeters
• CPC Class Codes: G01J 1/44 Electric circuits for command of an exposure part G03B7/02
• CPC Class Codes: G01N 21/359 using near infrared light

Abstract

A physiological sensor includes a light source in optical communication with a light detector. A controller is in communication with the light detector via a connector. A booster circuit is in communication with the light detector and the connector. The booster circuit may be configured to buffer signals generated by the light detector and reduce an input capacitance on either the controller or terminals of the connector. In various embodiments, the booster circuit may be disposed on the connector for a reusable cable or a disposable sensor pad.

Claims

1. A sensor comprising:

a light source;

a light detector in optical communication with said light source;

a connector in communication with said light detector and said light source; and

a booster circuit in communication with said light detector and wherein said booster circuit is disposed on said connector.

2. A sensor as set forth in claim 1, further comprising a sensor pad and wherein said light source and said light detector are disposed on said sensor pad.

3. A sensor as set forth in claim 2, wherein said sensor pad is formed from a unitary article of manufacture.

4. A sensor as set forth in claim 2, wherein said connector is spaced from said sensor pad.

5. A sensor as set forth in claim 1, wherein said connector includes plurality of terminals.

6. A sensor as set forth in claim 1, wherein each terminal is electrically connected to at least one of said light source and said light detector.

7. A sensor as set forth in claim 1, wherein said booster circuit includes at least one of a trans-impedance amplifier, an operational amplifier, a field effect transistor, and a capacitor.

8. A sensor as set forth in claim 1, wherein said connector is configured to communicate with a controller having an amplifier.

9. A sensor as set forth in claim 1, wherein said connector is disposed on a reusable cable.

10. A sensor as set forth in claim 1, wherein said booster circuit is configured to reduce an input capacitance on at least one of a controller in communication with said connector and said connector.

11. A sensor as set forth in claim 9, wherein said amplifier is a trans-impedance amplifier configured to convert current to voltage.

12. A sensor as set forth in claim 9, wherein said connector is interchangeable with a plurality of different sensor pads.

13. A sensor as set forth in claim 9, wherein said connector includes a memory chip configured to indicate the presence of said booster circuit.

14. A sensor as set forth in claim 13, wherein said memory chip is connected to a communication bus.

15. A sensor as set forth in claim 1, wherein said connector is disposed on a reusable sensor cable.

16. A sensor as set forth in claim 15, wherein said connector is interchangeable with a plurality of different sensor pads.

17. A sensor as set forth in claim 1, wherein said connector is backwards compatible.

18. A connector comprising:

a plurality of terminals; and

a booster circuit in communication with at least one of said plurality of terminals and wherein said booster circuit is configured to reduce an input capacitance of at least one of said plurality of terminals.

19. A connector as set forth in claim 18, wherein said booster circuit includes at least one of a trans-impedance amplifier, an operational amplifier, a field effect transistor, and a capacitor.

20. A connector as set forth in claim 18, further comprising a memory chip configured to indicate the presence of said booster circuit.

21. A connector as set forth in claim 18, wherein said memory chip is connected to a communication bus disposed on a sensor pad.

22. A sensor comprising:

a sensor pad having a light source and a light detector circuit in optical communication with said light source, said sensor pad being configured to be disposed on body tissue;

a connector in communication with said light detector and said light source, wherein said connector includes a plurality of terminals; and

a booster circuit in communication with said light detector and wherein said booster circuit is disposed on said connector and is configured to reduce an input capacitance of at least one of said plurality of terminals.