White LED package structure having a silicon substrate and method of making the same

• US 7,741,772 B2
• Filed: 04/18/2007
• Issued: 06/22/2010
• Est. Priority Date: 02/08/2007
• Status: Expired due to Fees

• Current Assignee: Walsin Lihwa Corporation
• Original Assignee: TOUCH MICRO-SYSTEM TECHNOLOGY CORP. (Walsin Lihwa Corporation)
• Inventors: Lin, Hung-Yi, Chang, Hong-Da
• Primary Examiner(s): Williams; Joseph L
• Assistant Examiner(s): Coughlin; Andrew J
• Application Number:
  US11/736,595
• Publication Number:
  US 20080191605A1
• Time in Patent Office: 1,161 Days
• Field of Search: 313/500, 313/501, 313/512, 438/28, 257/910
• US Class Current: 313/500
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.

Claims

1. A white LED package structure having a silicon substrate comprising:

a silicon substrate having a plurality of cup-structures thereon, and a distance between the adjacent cup-structures is substantially less than 10 micrometers;

a reflective layer covering a top surface of the silicon substrate;

a transparent insulating layer covering the reflective layer;

a plurality of metal bumps respectively disposed on the transparent insulating layer in each cup-structure;

a plurality of electrodes disposed on the transparent insulating layer between the cup-structures;

a plurality of blue LEDs having a plurality of various wavelengths, respectively disposed on each metal bump in each cup-structure, and the blue LEDs electrically connected to the electrodes; and

a phosphor structure covering the cup-structures of the silicon substrate, the phosphor structure comprising a plurality of kinds of phosphor powders and a sealing material, and each kind of the phosphor powder capable of converting blue light within certain wavelength into yellow light.

2. The white LED package structure of claim 1, wherein a top view shape of each cup-structure is geometric.

3. The white LED package structure of claim 1, wherein the cup-structures are arranged in a rectangular array.

4. The white LED package structure of claim 1, wherein the wavelengths of the blue LEDs comprises three specifications, 450±

5 nm, 460±

5 nm and 470±

5 nm.

5. The white LED package structure of claim 1, wherein a shape of the phosphor structure is a flattop pyramid-shaped, a top surface of the flattop pyramid is flat, and sidewalls of the flattop pyramid are inclined.

6. The white LED package structure of claim 1, wherein sidewalls of each cup-structure are inclined.

7. The white LED package structure of claim 1, wherein the reflective layer is a metal or an optical film.