Electro-optical device and electronic device

• US 7,741,775 B2
• Filed: 04/20/2006
• Issued: 06/22/2010
• Est. Priority Date: 06/04/1999
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Konuma, Toshimitsu, Yamamoto, Kunitaka, Koyama, Jun, Yamazaki, Shunpei
• Primary Examiner(s): Won; Bumsuk
• Assistant Examiner(s): Breval; Elmito
• Application Number:
  US11/407,145
• Publication Number:
  US 20060192205A1
• Time in Patent Office: 1,524 Days
• Field of Search: 313495-512, 315/169.3, 315/169.4, 257/40, 257/79, 257/72, 257/181.1, 257/194, 428/690, 445 24- 25, 349/139
• US Class Current: 313/512
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 29/42384 for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
• CPC Class Codes: H01L 29/78621 with LDD structure or an extension or an offset region or characterised by the doping profile
• CPC Class Codes: H01L 29/78627 with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
• CPC Class Codes: H01L 29/78645 with multiple gate
• CPC Class Codes: H01L 29/78696 characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel H01L29/78612 takes precedence; transistors having a drain offset region or a lightly doped drain [LDD] H01L29/78621
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/1213 the pixel elements being TFTs
• CPC Class Codes: H10K 59/123 Connection of the pixel electrodes to the thin film transistors [TFT]
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]

Abstract

An object of the present invention is to provide an EL display device having a high operation performance and reliability.

The switching TFT 201 formed within a pixel has a multi-gate structure, which is a structure which imposes an importance on reduction of OFF current value. Further, the current control TFT 202 has a channel width wider than that of the switching TFT to make a structure appropriate for flowing electric current. Morever, the LDD region 33 of the current control TFT 202 is formed so as to overlap a portion of the gate electrode 35 to make a structure which imposes importance on prevention of hot carrier injection and reduction of OFF current value.

Claims

1. A semiconductor device comprising:

a first substrate over which a pixel portion is provided;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

2. The semiconductor device according to claim 1, wherein the first substrate is a plastic substrate.

3. The semiconductor device according to claim 1, wherein the second substrate includes an organic resin.

4. The semiconductor device according to claim 1, wherein the EL layer contains an organic EL material.

5. The semiconductor device according to claim 1, wherein the EL layer contains an inorganic EL material.

6. The semiconductor device according to claim 1, wherein the semiconductor device is incorporated into an electronic device selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, a mobile computer, a mobile telephone, an electronic book, and an image playback device.

7. The semiconductor device according to claim 1, wherein the second substrate is a glass substrate.

8. A semiconductor device comprising:

a first substrate over which a pixel portion is provided;

an insulating film formed over the first substrate;

a wiring formed over the insulating film and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a passivation film over the second electrode, the passivation film being in contact with the first portion of the wiring; and

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the insulating film,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

9. The semiconductor device according to claim 8, wherein the EL layer contains an organic EL material.

10. The semiconductor device according to claim 8, wherein the EL layer contains an inorganic EL material.

11. The semiconductor device according to claim 8, wherein the semiconductor device is incorporated into an electronic device selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, a mobile computer, a mobile telephone, an electronic book, and an image playback device.

12. The semiconductor device according to claim 8, wherein the second substrate is a glass substrate.

13. A semiconductor device comprising:

a first substrate over which a pixel portion is provided;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a passivation film over the second electrode, the passivation film being in contact with the first portion of the wiring;

a second substrate over the EL element; and

a drying agent provided between the EL element and the second substrate,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

14. The semiconductor device according to claim 13, wherein the drying agent includes barium oxide.

15. The semiconductor device according to claim 13, wherein the pixel portion including the EL element is surrounded by the drying agent.

16. The semiconductor device according to claim 13, wherein the EL layer contains an organic EL material.

17. The semiconductor device according to claim 13, wherein the EL layer contains an inorganic EL material.

18. The semiconductor device according to claim 13, wherein the semiconductor device is incorporated into an electronic device selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, a mobile computer, a mobile telephone, an electronic book, and an image playback device.

19. The semiconductor device according to claim 13, wherein the second substrate is a glass substrate.

20. A semiconductor device comprising:

a first substrate over which a pixel portion is provided;

a thin film transistor formed over the first substrate and in the pixel portion;

an interlayer insulating film formed over the thin film transistor;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element, which is electrically connected to the thin film transistor, over the first substrate, the EL element including a first electrode, a second electrode, and an EL layer between the first and second electrodes; and

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and between the first substrate and the interlayer insulating film and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

21. The semiconductor device according to claim 20, wherein the EL layer contains an organic EL material.

22. The semiconductor device according to claim 20, wherein the EL layer contains an inorganic EL material.

23. The semiconductor device according to claim 20, wherein the semiconductor device is incorporated into an electronic device selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, a mobile computer, a mobile telephone, an electronic book, and an image playback device.

24. The semiconductor device according to claim 20, wherein the second substrate is a glass substrate.

25. The semiconductor device according to claim 20, wherein the interlayer insulating film is an organic resin.

26. The semiconductor device according to claim 20, wherein the semiconductor device further comprises an insulating layer formed over and in contact with the first substrate, and wherein the insulating layer is interposed between the first substrate and the wiring.

27. The semiconductor device according to claim 20, wherein the semiconductor device further comprises a passivation film formed between the first portion of the wiring and the interlayer insulating film.

28. The semiconductor device according to claim 20, wherein a contact hole which penetrates the interlayer insulating film is provided over the first portion of the wiring, and wherein the first portion of the wiring is electrically connected to the second electrode through the contact hole.

29. A car audio system comprising:

a display device, the display device comprising;

a first substrate over which a pixel portion is provided;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

30. The car audio system according to claim 29, wherein the first substrate is a plastic substrate.

31. The car audio system according to claim 29, wherein the second substrate includes an organic resin.

32. The car audio system according to claim 29, wherein the EL layer contains an organic EL material.

33. The car audio system according to claim 29, wherein the EL layer contains an inorganic EL material.

34. The car audio system according to claim 29, wherein the second substrate is a glass substrate.

35. A car audio system comprising:

a display device, the display device comprising;

a first substrate over which a pixel portion is provided;

an insulating film formed over the first substrate;

a wiring formed over the insulating film and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a passivation film over the second electrode, the passivation film being in contact with the first portion of the wiring; and

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the insulating film,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

36. The car audio system according to claim 35, wherein the EL layer contains an organic EL material.

37. The car audio system according to claim 35, wherein the EL layer contains an inorganic EL material.

38. The car audio system according to claim 35, wherein the second substrate is a glass substrate.

39. A car audio system comprising:

a display device, the display device comprising;

a first substrate over which a pixel portion is provided;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a passivation film over the second electrode, the passivation film being in contact with the first portion of the wiring;

a second substrate over the EL element; and

a drying agent provided between the EL element and the second substrate,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second glass substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

40. The car audio system according to claim 39, wherein the drying agent includes barium oxide.

41. The car audio system according to claim 39, wherein the pixel portion including the EL element is surrounded by the drying agent.

42. The car audio system according to claim 39, wherein the EL layer contains an organic EL material.

43. The car audio system according to claim 39, wherein the EL layer contains an inorganic EL material.

44. The car audio system according to claim 39, wherein the second substrate is a glass substrate.

45. A car audio system comprising:

a display device, the display device comprising;

a first substrate over which a pixel portion is provided;

a thin film transistor formed over the first substrate and in the pixel portion;

an interlayer insulating film formed over the thin film transistor;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element, which is electrically connected to the thin film transistor, over the first substrate, the EL element including a first electrode, a second electrode, and an EL layer between the first and second electrodes; and

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate opposing the first substrate comprises a first thickness at a first region and a second thickness at a second region, the first region adhering to the first transistor with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and between the first substrate and the interlayer insulating film and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate,

wherein the third portion of the wiring is located outside the first region, and

wherein a part of the first portion of the wiring is covered with the second electrode.

46. The car audio system according to claim 45, wherein the EL layer contains an organic EL material.

47. The car audio system according to claim 45, wherein the EL layer contains an inorganic EL material.

48. The car audio system according to claim 45, wherein the interlayer insulating film is an organic resin.

49. The car audio system according to claim 45, wherein the display device further comprises an insulating layer formed over and in contact with the first substrate, and wherein the insulating layer is interposed between the first substrate and the wiring.

50. The car audio system according to claim 45, wherein the display device further comprises a passivation film formed between the first portion of the wiring and the interlayer insulating film.

51. The car audio system according to claim 45, wherein a contact hole which penetrates the interlayer insulating film is provided over the first portion of the wiring, and wherein the first portion of the wiring is electrically connected to the second electrode through the contact hole.

52. A semiconductor device comprising:

a first substrate over which a pixel portion is provided;

a thin film transistor formed over the first substrate and in the pixel portion;

an interlayer insulating film formed over the thin film transistor;

a wiring formed over the first substrate and outside the pixel portion, the wiring comprising a first portion, a second portion, and a third portion;

an EL element over the first substrate, the EL element comprising an EL layer interposed between a first electrode and a second electrode;

a passivation film over the second electrode, the passivation film being in contact with the interlayer insulating film; and

a second substrate over the EL element,

wherein the second substrate is bonded to the first substrate with an adhesive,

wherein the second substrate comprises a first region and a second region, the first region adhering to the first substrate with the adhesive, and the second region is located inside the first region and depressed relative to the first region,

wherein the first portion of the wiring is located under the second region and electrically connected to the second electrode,

wherein the second portion of the wiring is located under the first region and interposed between the adhesive and the first substrate, and

wherein the third portion of the wiring is located outside the first region.

53. The semiconductor device according to claim 52, wherein the first substrate is a plastic substrate.

54. The semiconductor device according to claim 52, wherein the second substrate includes an organic resin.

55. The semiconductor device according to claim 52, wherein the EL layer contains an organic EL material.

56. The semiconductor device according to claim 52, wherein the EL layer contains an inorganic EL material.

57. The semiconductor device according to claim 52, wherein the semiconductor device is incorporated into an electronic device selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation system, a personal computer, a mobile computer, a mobile telephone, an electronic book, and an image playback device.