Flexible segmented image sensor

• US 7,742,090 B2
• Filed: 12/22/2006
• Issued: 06/22/2010
• Est. Priority Date: 12/22/2006
• Status: Expired due to Fees

• Current Assignee: Palo Alto Research Center, Inc. (Xerox Holdings Corp.)
• Original Assignee: Palo Alto Research Center, Inc. (Xerox Holdings Corp.)
• Inventors: Lu, Jeng Ping, Sambandan, Sanjiv, Street, Robert A.
• Primary Examiner(s): Ometz; David L
• Assistant Examiner(s): Garces-Rivera; Angel L
• Application Number:
  US11/644,072
• Publication Number:
  US 20080151089A1
• Time in Patent Office: 1,278 Days
• Field of Search: None
• US Class Current: 348/294
• CPC Class Codes: H01L 27/14601 Structural or functional details thereof
• CPC Class Codes: H01L 27/14692 Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
• CPC Class Codes: H01L 31/03921 including only elements of Group IV of the Periodic Table
• CPC Class Codes: H04N 25/00 Circuitry of solid-state image sensors [SSIS]; Control thereof
• CPC Class Codes: H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A method of making a curved sensor is described. The method involves projecting portions of a curved three dimensional structure such as a hemisphere onto a two dimensional substrate in an outline pattern. The outline pattern typically serves as a perimeter of a sensor. After forming a sensor in the shape of the outline pattern, the two dimensional substrate is flexed to form a three dimensional sensor structure.

Claims

1. A segmented, curved sensor comprising:

a first pixelated curved sensor segment on a substrate;

a second pixelated curved sensor segment on the substrate, the first curved sensor segment and the second curved sensor segment joined together at a joint on the substrate to form at least a portion of a hemisphere, the first and second segments joined by address lines that curve out of the arc of the hemisphere formed by the first pixelated curved sensor segment and the second pixelated curved sensor segment.

2. The segmented, curved sensor of claim 1 further comprising:

a third pixelated curved sensor segment, the third curved sensor segment joined to the second curved sensor segment to form at least a portion of a hemisphere.

3. The segmented, curved sensor of claim 2 wherein the joint between the first curved sensor segment and the second curved sensor segment is formed by bending the sensor in a region between the first curved sensor segment and the second curved sensor segment.

4. The segmented, curved sensor of claim 1 wherein the first curved sensor segment includes a plurality of pixels, each pixel addressed by a gate line and a data line.

5. The segmented, curved sensor of claim 4 wherein each pixel includes a thin film transistor.

6. The segmented, curved sensor of claim 1 wherein at least one of the pixelated curved sensor segments is a polygon.

7. An imaging system including a segmented hemispherical sensor comprising:

a segmented hemispherical sensor made up of curved hemispherical sensor segments;

a lens system that focuses light in a curved focal plane onto the segmented hemispherical sensor; and

,

an image processor that receives electrical signals from the segmented hemispherical sensor and generates an image.

8. The imaging system of claim 7 wherein the image processor couples to gate lines and data lines in the segmented hemispherical sensors.