System and method for a combined contact and non-contact wafer cleaning module

• US 7,743,449 B2
• Filed: 12/23/2005
• Issued: 06/29/2010
• Est. Priority Date: 06/28/2002
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Mikhaylichenko, Katrina, deLarios, John, Ravkin, Michael
• Primary Examiner(s): Spisich; Mark
• Application Number:
  US11/316,780
• Publication Number:
  US 20060096048A1
• Time in Patent Office: 1,649 Days
• Field of Search: 15/77, 15/882, 15/883
• US Class Current: 15/77
• CPC Class Codes: B08B 1/32 using rotary cleaning members
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes

Abstract

A system and a method for cleaning and rinsing a wafer includes at least three rollers that are capable of supporting a wafer by an edge of the wafer. At least one of the rollers is driven and thereby capable of rotating the wafer. At least one of the rollers is a movable roller mounted on an actuator. The system and method also includes a first movable scrubbing roller capable of being moved away from and alternatively to the first side of the wafer. A second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer is also included. The second side of the wafer opposes the first side of the wafer. The system and method also includes at least one first side nozzle directed toward the first side of the wafer and at least one second side nozzle directed toward the second side of the wafer.

Claims

1. A system for single side contact cleaning of a wafer comprising:

at least three edge rollers, the at least three edge rollers capable of fully supporting a wafer by an edge of the wafer;

a first actuator having at least one of the edge rollers mounted thereon;

a second actuator having a first scrubbing roller mounted thereon; and

a controller coupled to the first actuator and the second actuator, the controller capable of applying a variable first scrubbing force to a first side of the wafer through the second actuator and the first scrubbing roller and wherein the controller is further capable of applying a variable second force to the edge of the wafer through the first actuator and the at least one edge roller, the second force being proportional to and sufficient to fully counteract the variable first scrubbing force applied to the first side of the wafer.

2. The system of claim 1, further comprising a drive system coupled to at least one of the edge rollers.

3. The system of claim 1, further comprising a second side nozzle oriented toward a second side of the wafer, the second side being opposite from the first side of the wafer.

4. The system of claim 3, further comprising:

a cleaning solution supply coupled to the scrubbing roller, the cleaning solution capable of being applied to the first side of the wafer; and

a second solution supply coupled to the second side nozzle.

5. The system of claim 4, wherein the second side nozzle is capable of delivering a second side solution to the second side of the wafer.

6. The system of claim 5, wherein the second side solution is capable of diluting the cleaning solution.

7. The system of claim 6, wherein the second side solution includes deionized water.

8. The system of claim 4, wherein the cleaning solution is applied through the first scrubbing roller.

9. The system of claim 4, wherein the cleaning solution is applied directly to the first side of the wafer.

10. The system of claim 5, further comprising a megasonic transducer capable of applying megasonic energy to the second side solution as the second solution is applied to the second side of the wafer.

11. The system of claim 10, wherein the megasonic transducer is coupled to the second side nozzle.

12. The system of claim 1, wherein the first actuator is capable of moving the movable edge roller to and alternatively away from the edge of the wafer.

13. The system of claim 1, wherein the scrubbing roller has a length greater than or equal to a diameter of the wafer.

14. A system for alternating single side contact cleaning of a wafer comprising:

at least three edge rollers, the at least three edge rollers capable of fully supporting a wafer by an edge of the wafer;

a first actuator having at least one of the edge rollers mounted thereon;

a second actuator having a first scrubbing roller mounted thereon;

a controller coupled to the first actuator and the second actuator, the controller capable of applying a variable first scrubbing force to a first side of the wafer through the second actuator and the first scrubbing roller and wherein the controller is further capable of applying a variable second force to the edge of the wafer through the first actuator and the at least one edge roller, the second force being proportional to and sufficient to fully counteract the variable first scrubbing force applied to the first side of the wafer; and

a third actuator having a second scrubbing roller mounted thereon, the third actuator being coupled to the controller, the second scrubbing roller capable of being moved toward and alternatively away from a second side of the wafer opposite the first side, the controller capable of applying a variable second scrubbing force to the second side of the wafer through the third actuator and the second scrubbing roller and wherein the controller is further capable of applying a variable fourth force to the edge of the wafer through the first actuator and the at least one edge roller, the variable fourth force being proportional to and sufficient to fully counteract the variable second scrubbing force and the controller is capable of moving a selected one of the first scrubbing roller and the second scrubbing roller away from the respective side of the wafer when the other of the first and second scrubbing rollers is in contact with the respective side of the wafer.