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Method for forming cast flexible substrate and resultant substrate and electronic device

  • US 7,743,492 B2
  • Filed: 02/08/2008
  • Issued: 06/29/2010
  • Est. Priority Date: 02/08/2008
  • Status: Active Grant
First Claim
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1. A method for forming an electronic device comprising:

  • forming a master having a casting surface;

    depositing a substrate material onto the casting surface to form a flexible substrate sheet of predetermined thickness, wherein the flexible substrate sheet has a circuit-side surface that is formed against the casting surface, and a back surface;

    releasing the flexible substrate sheet from the master;

    securing the flexible substrate sheet against a carrier, with the circuit-side surface facing outward; and

    forming the electronic device on the circuit-side surface of the flexible substrate sheet while the back surface of the flexible substrate sheet is secured against the carrier.

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