Solderable lid or cover for an electronic circuit

• US 7,743,963 B1
• Filed: 02/28/2006
• Issued: 06/29/2010
• Est. Priority Date: 03/01/2005
• Status: Expired due to Fees

• Current Assignee: Amerasia International Technology, Inc.
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Ward; Jessica L.
• Assistant Examiner(s): SAAD, ERIN BARRY
• Application Number:
  US11/364,607
• Time in Patent Office: 1,582 Days
• Field of Search: 228/179.1, 228/6.2, 228/180.1, 156/230, 174/50.61, 257/629, 257/704, 257/678
• US Class Current: 228/179.1
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 3/341 Surface mounted components

Abstract

A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.

Claims

1. A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising:

a non-solderable cover member having a surface defining a substantially continuous attachment pattern, wherein said non-solderable cover member is of a material that is not solderable;

a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the continuous attachment pattern; and

a layer of adhesive bonding said solderable metal layer to the continuous attachment pattern of said non-solderable cover member, wherein said solderable metal layer remains bonded to said non-solderable cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder,

whereby said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover.

2. The solderable cover of claim 1 wherein said non-solderable cover member includes an optically transparent cover, an electrically insulating cover, an electrically conductive cover, a planar cover, a domed cover, a cover having a base and a wall defining a cavity, or any combination thereof.

3. The solderable cover of claim 1 wherein the attachment pattern of said non-solderable cover member is planar and:

is defined by a continuous edge or by plural contiguous edges;

or

is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof;

or

is defined by a continuous edge or by plural contiguous edges and is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof.

4. The solderable cover of claim 1 wherein the material of said non-solderable cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof.

5. The solderable cover of claim 1 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof.

6. The solderable cover of claim 1 wherein said non-solderable cover member includes an optically transparent cover, an electrically insulating cover, an electrically conductive cover, a laminated cover, a formed laminated cover, or any combination thereof.

7. The solderable cover of claim 1 wherein said adhesive comprises a molecularly flexible adhesive.

8. The solderable cover of claim 1 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer.

9. The solderable cover of claim 8 in combination with an electronic substrate having a solderable attachment pattern thereon corresponding to the attachment pattern of said non-solderable cover member, wherein said layer of solder or solder paste is reflowed to solder said solderable metal layer of said solderable cover to the solderable attachment pattern of said electronic substrate.

10. A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising:

a non-solderable cover member having a base and one or more walls defining a cavity therein, wherein edges of the one or more walls distal the base define a planar continuous attachment pattern, and wherein said non-solderable cover member is of a material that is not solderable;

a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the planar continuous attachment pattern and attached to the edges of the one or more walls of said non-solderable cover member; and

a layer of adhesive bonding said solderable metal layer to the planar continuous attachment pattern of said non-solderable cover member, wherein said solderable metal layer remains bonded to said non-solderable cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder,

whereby said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover.

11. The solderable cover of claim 10 wherein said non-solderable cover member is electrically insulating, electrically conductive, domed, optically transparent, or any combination thereof.

12. The solderable cover of claim 10 wherein the planar attachment pattern of said non-solderable cover member is planar and:

is defined by a continuous edge or by plural contiguous edges;

or

is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof;

or

is defined by a continuous edge or by plural contiguous edges and is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof.

13. The solderable cover of claim 10 wherein the material of said non-solderable cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof.

14. The solderable cover of claim 10 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof.

15. The solderable cover of claim 10 wherein said adhesive comprises a molecularly flexible adhesive.

16. The solderable cover of claim 10 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer.

17. The solderable cover of claim 16 in combination with an electronic substrate having a solderable attachment pattern thereon corresponding to the attachment pattern of said non-solderable cover member, wherein said solder paste or said solder is reflowed to solder said solderable metal layer of said solderable cover to the solderable attachment pattern of said electronic substrate.

18. A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising:

a non-solderable planar cover member having an edge or edges defining a periphery, wherein the periphery defines a continuous planar attachment pattern, and wherein said non-solderable planar cover member is of a material that is not solderable;

a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the continuous planar attachment pattern and attached proximate the periphery of said non-solderable planar cover member; and

a layer of adhesive bonding said solderable metal layer to the continuous planar attachment pattern of said non-solderable planar cover member, wherein said solderable metal layer remains bonded to said non-solderable planar cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder,

wherein said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover.

19. The solderable cover of claim 18 wherein said non-solderable planar cover member is electrically insulating, electrically conductive, domed, optically transparent, or any combination thereof.

20. The solderable cover of claim 18 wherein the material of said non-solderable planar cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof.

21. The solderable cover of claim 18 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof.

22. The solderable cover of claim 18 wherein said adhesive comprises a molecularly flexible adhesive.

23. The solderable cover of claim 18 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer.

24. The solderable cover of claim 23 in combination with an electronic substrate having a solderable planar attachment pattern thereon corresponding to the planar attachment pattern of said non-solderable planar cover member, wherein said solder paste or said solder is reflowed to solder said solderable metal layer of said solderable cover to the solderable planar attachment pattern of said electronic substrate.