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Method for manufacturing semiconductor sensor

  • US 7,745,235 B2
  • Filed: 06/05/2008
  • Issued: 06/29/2010
  • Est. Priority Date: 03/09/2005
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing a semiconductor sensor, comprising the steps of:

  • removing a predetermined portion of a semiconductor substrate selectively except for at least a region where a supporting part is to be formed so as to form a weight arranging part and a flexible part; and

    forming a weight on a surface of the semiconductor substrate at the weight arranging part, and said weight comprises a resin part provided on the weight arranging part, said resin part being made of resin, and a central part provided on the resin part, said metal part including at least a metal.

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