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MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same

  • US 7,747,109 B2
  • Filed: 08/18/2006
  • Issued: 06/29/2010
  • Est. Priority Date: 08/19/2005
  • Status: Active Grant
First Claim
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1. A method of fabricating a MEMS device, comprising:

  • providing a substrate;

    depositing an electrode layer over the substrate;

    depositing a sacrificial layer over the electrode layer;

    patterning the sacrificial layer to form apertures;

    forming support structures at least partially within apertures in the sacrificial layer, wherein forming the support structure comprises depositing a layer of conformal support post material over the sacrificial layer and apertures, the support post having an internal residual stress; and

    depositing a movable layer over the support structures after forming the support structures, wherein the movable layer comprises a material having an internal residual stress, and wherein the materials of the movable layer and the support structures are selected such that the residual stress in the movable layer is balanced by residual stress in the support structures such that deflection of the movable layer caused by the residual stresses is minimized.

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