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MEMS sensor suite on a chip

  • US 7,748,272 B2
  • Filed: 03/20/2008
  • Issued: 07/06/2010
  • Est. Priority Date: 10/15/2004
  • Status: Active Grant
First Claim
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1. A monolithically integrated micro-electromechanical sensor suite formed on a semiconductor chip, comprising:

  • a silicon-on-insulator accelerometer; and

    a humidity sensor monolithically integrated with the silicon-on-insulator accelerometer.wherein the silicon-on-insulator accelerometer and the humidity sensor are commonly fabricated from a shared active silicon layer.

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