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Semiconductor device and manufacturing method of semiconductor device

  • US 7,750,358 B2
  • Filed: 11/13/2006
  • Issued: 07/06/2010
  • Est. Priority Date: 11/14/2005
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a substrate having a recess part, the recess part having a periphery and a floor;

    a light emitting element mounted within the recess part on the floor;

    an optically-transparent cover with a flat plate shape made of electrically insulative material which is installed above the light emitting element; and

    a fluorescent substance film formed on only a portion of the optically-transparent cover, the periphery of the recess part being directly bonded to a portion of the optically-transparent cover other than the portion on which the fluorescent substance film is formed.

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