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Fingerprint sensing assemblies and methods of making

  • US 7,751,601 B2
  • Filed: 10/04/2005
  • Issued: 07/06/2010
  • Est. Priority Date: 10/04/2004
  • Status: Active Grant
First Claim
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1. A fingerprint sensing module comprising:

  • a sensor substrate having a sensing side and a circuit side;

    an image sensor including conductive traces on the circuit side of the sensor substrate and comprising;

    at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger,at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and

    a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor.

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