Fingerprint sensing assemblies and methods of making
First Claim
Patent Images
1. A fingerprint sensing module comprising:
- a sensor substrate having a sensing side and a circuit side;
an image sensor including conductive traces on the circuit side of the sensor substrate and comprising;
at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger,at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and
a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor.
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Abstract
A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.
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Citations
31 Claims
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1. A fingerprint sensing module comprising:
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a sensor substrate having a sensing side and a circuit side; an image sensor including conductive traces on the circuit side of the sensor substrate and comprising; at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger, at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A fingerprint sensing module comprising:
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a flexible substrate having a sensing side and a circuit side; an image sensor including conductive traces on the circuit side of the flexible substrate and comprising; at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger, at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and a velocity sensor including conductive traces on the circuit side of the flexible substrate; a sensor circuit including at least one integrated circuit mounted on the circuit side of the flexible substrate and electrically connected to the image sensor and the velocity sensor; and a rigid substrate, wherein the circuit side of the flexible substrate is affixed to a surface of the rigid substrate.
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24. A fingerprint sensing module comprising:
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a rigid substrate; an image sensor including conductive traces on the substrate and comprising; at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger, at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and a velocity sensor including conductive traces on the substrate; and a sensor circuit including at least one integrated circuit mounted on the substrate and electrically connected to the image sensor and the velocity sensor, wherein the image sensor, the velocity sensor and the sensor circuit are mounted on a first surface of the rigid substrate. - View Dependent Claims (25, 26, 27, 28)
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29. A method for making a fingerprint sensing module, comprising:
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providing a flexible substrate having a sensing side and a circuit side; forming an image sensor including conductive traces on the circuit side of the flexible substrate and comprising; at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger, at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and forming a velocity sensor including conductive traces on the circuit side of the flexible substrate; mounting a sensor circuit including at least one integrated circuit on the circuit side of the flexible substrate; and affixing the circuit side of the flexible substrate to a surface of a rigid substrate.
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30. A fingerprint sensing module comprising:
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a first flexible substrate having an image sensor including conductive traces on the first flexible substrate, said image sensor comprising; at least one linear array of capacitive sensors for capacitive sensing of ridge peaks and ridge valleys of a fingerprint on a moving finger, at least one image pickup plate disposed generally orthogonally to a direction of movement of the finger, and at least one drive plate in spaced relation to said at least one image pickup plate to define at least one sensor gap between the respective at least one image drive plate and said at least one image pickup plate, wherein the ridge peaks and ridge valleys of the fingerprint passing over the at least one sensor gap produce a change in capacitance between the respective at least one image drive plate and said at least one image pickup plate; and said first flexible substrate also having a sensor integrated circuit mounted on the first flexible substrate and electrically connected to the image sensor; said conductive traces operating as a velocity sensor; and a base for mounting the first flexible substrates so that the conductive traces of the image sensor and the velocity sensor are substantially unitary. - View Dependent Claims (31)
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Specification