Hybrid on-chip-off-chip transformer
First Claim
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1. A hybrid on-chip-off-chip transformer comprising:
- an off-chip winding section coupled to produce a first electromagnetic signal from a reference source; and
an on-chip winding section coupled to derive a second electromagnetic signal from the first electromagnetic signal when the on-chip winding section is within a proximal coupling distance of the off-chip winding section, in which the on-chip winding section is integrated on a multiple layer integrated circuit (IC) die that also contains integrated circuitry to respond to the second electromagnetic signal;
the on-chip winding section including a first plurality of multiple turn coils on a first layer of the multiple layer IC die, wherein the proximal coupling distance provides a substantially perpendicular, with respect to the first layer of the multiple layer IC die, electromagnetic field of the first electromagnetic signal to the first plurality of multiple turn coils and a second plurality of multiple turn coils on a second layer of the multiple layer IC die, wherein the proximal coupling distance provides a substantially perpendicular, with respect to the second layer of the multiple layer IC die, electromagnetic field of the first electromagnetic signal to the second plurality of multiple turn coils, in which the first and second pluralities of multiple turn coils provide the second electromagnetic signal.
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Abstract
A hybrid on-chip-off-chip transformer includes an off-chip winding section and an on-chip winding section. The off-chip winding section is coupled to produce a first electromagnetic signal from a reference source. The on-chip winding section is coupled to derive a second electromagnetic signal from the first electromagnetic signal when the on-chip winding section is with in a proximal coupling distance of the off-chip winding section.
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Citations
6 Claims
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1. A hybrid on-chip-off-chip transformer comprising:
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an off-chip winding section coupled to produce a first electromagnetic signal from a reference source; and an on-chip winding section coupled to derive a second electromagnetic signal from the first electromagnetic signal when the on-chip winding section is within a proximal coupling distance of the off-chip winding section, in which the on-chip winding section is integrated on a multiple layer integrated circuit (IC) die that also contains integrated circuitry to respond to the second electromagnetic signal; the on-chip winding section including a first plurality of multiple turn coils on a first layer of the multiple layer IC die, wherein the proximal coupling distance provides a substantially perpendicular, with respect to the first layer of the multiple layer IC die, electromagnetic field of the first electromagnetic signal to the first plurality of multiple turn coils and a second plurality of multiple turn coils on a second layer of the multiple layer IC die, wherein the proximal coupling distance provides a substantially perpendicular, with respect to the second layer of the multiple layer IC die, electromagnetic field of the first electromagnetic signal to the second plurality of multiple turn coils, in which the first and second pluralities of multiple turn coils provide the second electromagnetic signal. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification