Sample processing device compression systems and methods

• US 7,754,474 B2
• Filed: 07/05/2005
• Issued: 07/13/2010
• Est. Priority Date: 07/05/2005
• Status: Active Grant

• Current Assignee: Diasorin Italia SPA
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Aysta, James E., Bedingham, William, Robole, Barry W.
• Primary Examiner(s): Beisner; William H
• Assistant Examiner(s): HOBBS, MICHAEL L
• Application Number:
  US11/174,757
• Publication Number:
  US 20070010007A1
• Time in Patent Office: 1,834 Days
• Field of Search: 435/809, 374/24, 374/51, 219/3, 219/428, 219/429, 219/432, 219/435, 436/45
• US Class Current: 435/287.2
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2300/041 Connecting closures to device or container
• CPC Class Codes: B01L 2300/0803 Disc shape
• CPC Class Codes: B01L 2300/1805 Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
• CPC Class Codes: B01L 2300/1861 using radiation
• CPC Class Codes: B01L 3/50851 specially adapted for heating or cooling samples laboratory heating apparatus B01L7/00; incubators C12M
• CPC Class Codes: B01L 3/50853 with covers or lids
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: B01L 9/52 Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
• CPC Class Codes: G01N 2035/00366 Several different temperatures used
• CPC Class Codes: G01N 35/025 having a carousel or turntable for reaction cells or cuvettes
• CPC Class Codes: Y10S 435/809 Incubators or racks or holders for culture plates or containers

Abstract

Sample processing systems and methods of using those systems for processing sample materials located in sample processing devices are disclosed. The sample processing systems include a rotating base plate on which the sample processing devices are located during operation of the systems. The systems also include a cover and compression structure designed to force a sample processing device towards the base plate. The preferred result is that the sample processing device is forced into contact with a thermal structure on the base plate. The systems and methods of the present invention may include one or more of the following features to enhance thermal coupling between the thermal structure and the sample processing device: a shaped transfer surface, magnetic compression structure, and floating or resiliently mounted thermal structure. The methods may preferably involve deformation of a portion of a sample processing device to conform to a shaped transfer surface.

Claims

1. A system for processing sample processing devices, the system comprising:

a base plate operatively coupled to a drive system, wherein the drive system rotates the base plate about a rotation axis, wherein the rotation axis defines a z-axis;

thermal structure operatively attached to the base plate, wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate;

a cover facing the transfer surface, wherein the cover comprises an inner compression ring and an outer compression ring;

compression structure operatively attached to the cover to force the cover in a first direction along the z-axis towards the transfer surface, wherein the inner and outer compression rings contact and urge a sample processing device located between the cover and the transfer surface into contact with transfer surface;

one or more resilient members operatively coupled to one or both of the cover and thermal structure, wherein the one or more resilient members provide a biasing force opposing the force of the compression structure forcing the cover towards the base plate, wherein the one or more resilient members couple the thermal structure to the base plate, and wherein the thermal structure is movable relative to the first surface of the base plate when a portion of a sample processing device located between the cover and the base plate is urged into contact with the transfer surface of the thermal structure; and

an energy source adapted to deliver thermal energy to the thermal structure while the base plate is rotating about the rotation axis.

2. A system according to claim 1, wherein the exposed transfer surface comprises a convex transfer surface in the form of an annular ring.

3. A system according to claim 1, wherein the exposed transfer surface is in the form of an annular ring that comprises an inner edge and an outer edge proximate the first surface of the base plate, wherein the outer edge of the transfer surface is offset in the first direction along the z-axis relative to the inner edge of the transfer surface.

4. A system according to claim 3, wherein the exposed transfer surface comprises a convex transfer surface.

5. A system according to claim 1, wherein substantially all compression force transfer between the cover and the thermal structure occurs through the inner compression ring and the outer compression ring.

6. A system according to claim 1, wherein the one or more resilient members comprise a flat spring.

7. A system according to claim 3, wherein the exposed transfer surface comprises a raised portion having a maximum height located between the inner edge and the outer edge of the annular ring.

8. A system according to claim 1, wherein the compression structure comprises one or more magnetic elements operatively attached to the cover and base plate, wherein magnetic attraction between the one or more magnetic elements attached to the cover and the base plate draw the cover towards the first surface of the base plate.

9. A system according to claim 8, wherein the one or more magnetic elements comprise permanent magnets.

10. A system according to claim 8, wherein the one or more magnetic elements comprise a first set of permanent magnets operatively attached to the cover and a second set of permanent magnets operatively attached to the base plate.

11. A system according to claim 1, wherein the compression structure comprises mechanical clamps operatively attached to the cover and the base plate.

12. A system according to claim 1, wherein the energy source comprises an electromagnetic energy source adapted to direct electromagnetic energy onto a portion of the thermal structure while the base plate is rotating about the rotation axis.

13. A system for processing sample processing devices, the system comprising:

a base plate operatively coupled to a drive system, wherein the drive system rotates the base plate about a rotation axis, wherein the rotation axis defines a z-axis;

thermal structure operatively attached to the base plate, wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate, wherein the exposed transfer surface is in the form of an annular ring that comprises an inner edge and an outer edge proximate the first surface of the base plate, wherein the outer edge of the transfer surface is offset in the first direction along the z-axis relative to the inner edge of the transfer surface, and wherein the exposed transfer surface comprises a raised portion having a maximum height located between the inner edge and the outer edge of the annular ring;

a cover facing the transfer surface;

one or more magnetic elements operatively attached to the cover and base plate, wherein magnetic attraction between the one or more magnetic elements attached to the cover and the base plate draw the cover in a first direction along the z-axis towards the first surface of the base plate such that a sample processing device located between the cover and the base plate is urged into contact with the thermal structure of the base plate; and

an energy source adapted to deliver thermal energy to the thermal structure while the base plate is rotating about the rotation axis.

14. A system according to claim 13, wherein the one or more magnetic elements comprise permanent magnets.

15. A system according to claim 13, wherein the one or more magnetic elements comprise a first set of permanent magnets operatively attached to the cover and a second set of permanent magnets operatively attached to the base plate.

16. A system according to claim 13, further comprising one or more resilient members operatively coupled to one or both of the cover and thermal structure, wherein the one or more resilient members provide a biasing force opposing the magnetic attraction drawing the cover towards the first surface of the base plate.

17. A system according to claim 16, wherein the one or more resilient members couple the thermal structure to the base plate.

18. A system according to claim 17, wherein the thermal structure is movable relative to the first surface of the base plate when a portion of a sample processing device located between the cover and the base plate is urged into contact with the transfer surface of the thermal structure.

19. A system according to claim 17, wherein the one or more resilient members comprise a flat spring.

20. A system according to claim 13, wherein the exposed transfer surface comprises a convex transfer surface.

21. A system according to claim 13, wherein the energy source comprises an electromagnetic energy source adapted to direct electromagnetic energy onto a portion of the thermal structure while the base plate is rotating about the rotation axis.

22. A system for processing sample processing devices, the system comprising:

a base plate operatively coupled to a drive system, wherein the drive system rotates the base plate about a rotation axis;

a cover facing a first surface of the base plate;

compression structure operatively attached to the cover to force the cover towards the base plate;

thermal structure operatively attached to the base plate;

one or more resilient members operatively coupling the thermal structure to the base plate, wherein the one or more resilient members provide a biasing force opposing the force of the compression structure forcing the cover towards the base plate, wherein a portion of a sample processing device located between the cover and the first surface of the base plate is urged into contact with the thermal structure, and wherein the thermal structure is movable relative to the first surface of the base plate when a portion of a sample processing device located between the cover and the base plate is urged into contact with the thermal structure; and

an energy source adapted to deliver thermal energy to the thermal structure while the base plate is rotating about the rotation axis.

23. A system according to claim 22, wherein the one or more resilient members comprise a flat spring.

24. A system according to claim 22, wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate, wherein the exposed transfer surface is in the form of an annular ring that comprises an inner edge and an outer edge proximate the first surface of the base plate, and wherein the exposed transfer surface comprises a raised portion having a maximum height located between the inner edge and the outer edge of the annular ring.

25. A system according to claim 22, wherein the energy source comprises an electromagnetic energy source adapted to direct electromagnetic energy onto a portion of the thermal structure while the base plate is rotating about the rotation axis.

26. A system for processing sample processing devices, the system comprising:

a base plate operatively coupled to a drive system, wherein the drive system rotates the base plate about a rotation axis;

a cover facing a first surface of the base plate;

compression structure operatively attached to the cover to force the cover towards the base plate;

thermal structure operatively attached to the base plate;

one or more resilient members operatively coupling the thermal structure to the base plate, wherein the one or more resilient members provide a biasing force opposing the force of the compression structure forcing the cover towards the base plate, wherein a portion of a sample processing device located between the cover and the first surface of the base plate is urged into contact with the thermal structure, and wherein the thermal structure comprises a transfer surface exposed proximate a first surface of the base plate, wherein the exposed transfer surface is in the form of an annular ring that comprises an inner edge and an outer edge proximate the first surface of the base plate, and wherein the exposed transfer surface comprises a raised portion having a maximum height located between the inner edge and the outer edge of the annular ring; and

an energy source adapted to deliver thermal energy to the thermal structure while the base plate is rotating about the rotation axis.