Manufacture of mountable capped chips
First Claim
Patent Images
1. A method of making mountable devices comprising the steps of:
- (a) simultaneously mounting terminals of a terminal bearing element to a plurality of spaced-apart caps projecting upwardly from a main surface of at least a portion of a wafer having a plurality of individual spaced-apart active areas, each spaced-apart cap covering and protecting a respective spaced-apart active area of the wafer, the spaced-apart caps defining a plurality of channels between adjacent ones of the active areas and between adjacent ones of the caps; and
(b) electrically connecting the terminals mounted on said caps to the wafer by means of leads extending to contacts on the wafer disposed in said channels.
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Abstract
A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and the leads are aligned with channels or other depressions between the caps. The leads are connected to contacts on the wafer, and the wafer is severed to form individual units, each including terminals supported by the cap and connected to the contacts by the leads. The resulting units can be handled and processed in the same manner as ordinary chips or chip assemblies.
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Citations
24 Claims
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1. A method of making mountable devices comprising the steps of:
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(a) simultaneously mounting terminals of a terminal bearing element to a plurality of spaced-apart caps projecting upwardly from a main surface of at least a portion of a wafer having a plurality of individual spaced-apart active areas, each spaced-apart cap covering and protecting a respective spaced-apart active area of the wafer, the spaced-apart caps defining a plurality of channels between adjacent ones of the active areas and between adjacent ones of the caps; and (b) electrically connecting the terminals mounted on said caps to the wafer by means of leads extending to contacts on the wafer disposed in said channels. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of making electronic devices comprising the steps of:
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(a) simultaneously mounting a plurality of terminals of a terminal-bearing element to a structure defining an upper surface above a main surface of at least a portion of a wafer having a plurality of individual spaced-apart active areas, the structure covering and protecting individual spaced-apart active areas of the wafer, the structure having depressions extending towards the main surface of the wafer from the upper surface and contacts in said depressions, wherein a plurality of said contacts are disposed within a first one of said depressions; and (b) electrically connecting the terminals mounted on the upper surface to the wafer by means of leads extending to the contacts disposed in said depressions. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification