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Stacked die module including multiple adhesives that cure at different temperatures

  • US 7,755,204 B2
  • Filed: 09/25/2003
  • Issued: 07/13/2010
  • Est. Priority Date: 05/08/2002
  • Status: Active Grant
First Claim
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1. An integrated circuit comprising:

  • a stack comprising at least two semiconductor die, each of the semiconductor die being coupled together by a first adhesive, the first adhesive being curable at a first temperature; and

    a substrate coupled to one of the at least two semiconductor die by a second adhesive, the second adhesive being curable at a second temperature lower than the first temperature.

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